Industry Directory | Consultant / Service Provider / Manufacturer
1: ODM PCB layout, Gerber, circuit design 2: Make HDI PCB (1 to 38 layers) 3: PCB Assembly (SMT / DIP) 4: Firmware / APP coding for clients; 5: Housing / Casing / Enclosure design 6: CNC-customized fabrication for housing.
Industry Directory | Distributor / Manufacturer
For over 60 years, Kapp Alloy & Wire, Inc has been a premier manufacturer of Babbitt, solder, and metallizing spray wire. Our goal is perfection in solder and service.
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
New Equipment | Solder Materials
Kapp Alloy & Wire, Inc. is a world leader in high quality consistent Babbitt alloys. We combine high purity virgin raw materials and our proprietary Precision Microcasting™ process to create the world’s strongest, most consistent Babbitt. Like our wo
Electronics Forum | Thu Mar 13 14:12:31 EDT 2014 | davef
You're creating a new alloy on the surface of your board. The alloy will have a melting point determined by the constituent metals of the alloy. Your alloy consists of: * Lead-free HASL solderability protection on the board * Lead-free solder paste *
Electronics Forum | Tue Jul 19 06:07:30 EDT 2005 | GS
Yes Rob, I would like to know the type of metal finisching like JST097 or IPC-1066 or IEC .... suggest to do. I would like to avoid i.e. to get Bismuth finish on components terminals that I still have to solder with alloy containing Pb. Also to ha
Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Industry News | 2011-08-18 21:24:08.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
DescriptionThe Electrovert® Electra™ is an advanced, meticulously engineered wave soldering system designed for high-mass and high-volume manufacturers. Although intended for maximum throughput requirements, the Electra also offers maximum process fl
Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support
Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
SMTnet Express, September 9, 2021, Subscribers: 26,718, Companies: 11,435, Users: 26,839 Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates Manganese can
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
; this was consistent with work from others [6]. As a result some BGA components on notebook products required partial underfilling (or edge glue
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/top-10-smt-new-product-stories-of-2014_topic1520_post6150.html
. Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, excellent response-to-pause, and a strong oxidation barrier, even for long and hot profiles. At
