Specification Humidity Range:＜5%RH External Dimension:W600*D672*H632mm Internal Dimension:W598*D642*H525mm Capacity:202L Cabinet Color: black Structure:1mm thick carbon steel with antistatic paint. ESD Paint: 103~109 ω (surface resistance)
Overview • Almost 20 times faster than original 80C51 • 24 times faster multiplication (12 division) • Special Function Registers The DP8051CPU is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded controlle
Electronics Forum | Fri Mar 14 05:38:42 EDT 2008 | meritajs
Hello Could somebody inform us about real consumption of lead free solder alloy SN100C on your wave solder process. We do not use some antiaxidant and had had alloy consumption about 1 kg per hour. What is your experiance? All sugestion will be well
Electronics Forum | Tue Dec 06 09:38:13 EST 2011 | pszumny
Thanks, is it continuos connsumption or during start up ?
Industry News | 2020-11-03 18:16:39.0
2020 Global Surface Mount Technology Company Of The Year Award (Soldering Equipment)
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2023-09-18 14:10:01.0
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.
The LPKF ProtoFlow S reflow oven, with lead free capability, has significant advantages over previous models and rich features including a PC control software package. Learn more: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/solder
UVLED is widely used in all walks of life is reasonable, UVLED has a great advantage over UV curing, its emergence is very necessary. Firstly, the service life of the UV curing system is longer than that of the traditional UV curing system of 800-30
| https://productronica.com/en/trade-fair/tickets/gogreenticket/
. SDG 12 - Responsible consumption and production The recycling of organic waste contributes to sustainable waste management. SDG 13 - Climate actions Each biogas biodigester avoids 6.5 t CO
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/
of electricity-induced heat. Power regulation, energy consumption management, and even power distribution within the device are crucial in extending the battery life of IoT devices
