New SMT Equipment: convert clean process to non clean process (1)

Intro to IC Design & Fabrication Course

New Equipment |  

Next Scheduled Public Courses: May 6, 2008 ~ Dallas, TX May 7, 2008 ~ Singapore May 8, 2008 ~ Penang, Malaysia May 14, 2008 ~ Las Vegas May 14, 2008 ~ Boston, MA June 11, 2008 ~ Hsin-Chu, Taiwain July 18, 2008 ~ San Francisco, CA August 8, 2008 ~ S

PTI Seminars, Inc.

Electronics Forum: convert clean process to non clean process (21)

Converting to 'No-Clean' process

Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa

Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor

Re: Converting to 'No-Clean' process

Electronics Forum | Mon Apr 17 18:42:32 EDT 2000 | Russ

Murad, I have just completed a switch over in our facility to no-clean. We used Alpha 609 and 857 paste and wave flux respectively. We currently use Alpha UP78 paste, NR330 wave flux, NR205 liquid flux for touchup and cleanline 7000 wire solder as

Industry News: convert clean process to non clean process (175)

Nordson ASYMTEK and Nordson MARCH to Present Papers at Contamination, Cleaning, and Coating Conference in Amsterdam

Industry News | 2017-05-10 18:15:53.0

Nordson ASYMTEK and Nordson MARCH, Nordson companies (NASDAQ: NDSN), will present papers at the Conformal Coating Materials and Processes session at the Contamination, Cleaning, and Coating Conference being held in Amsterdam, Netherlands. Transitioning from Manual to Automated Conformal Coating, by Michael Szuch, Nordson ASYMTEK and Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures, by David Foote, Nordson MARCH, will be presented on Wednesday, May 24, 2017.

ASYMTEK Products | Nordson Electronics Solutions

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference Continues with a Presentation Dedicated to Reliability & Ruggedness

Industry News | 2016-09-15 18:08:04.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

Technical Library: convert clean process to non clean process (2)

Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance

Technical Library | 2019-08-14 22:20:55.0

Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.

KYZEN Corporation

Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies.

Technical Library | 2009-07-09 17:23:07.0

Sometimes you just cannot clean with water. Good examples of this are: circuits with batteries attached, cleaning prior to encapsulation, ionic cleanliness testing, and non-sealed or other water sensitive parts. High impedance or high voltage circuits need to be cleaned of flux residues and other soils to maximize performance and reliability and, in these types of circuits; water can be just as detrimental as fluxes. When solvent cleaning is called for, Hansen solubility parameters can help target the best solvent or solvent blend to remove the residue of interest, and prevent degradation of the assembly being manufactured. In short, using this approach can time, manufacturing cost and reduce product liability.

Austin American Technology

Express Newsletter: convert clean process to non clean process (1073)

Partner Websites: convert clean process to non clean process (756)

Microsoft Word - Purchase Terms and Conditions Rev 3-09 (VJN Clean 04232020 Rev.1)

ORION Industries | http://orionindustries.com/pdfs/Purchase_Terms_and_Conditions.pdf

. Title to risk of loss for non-conforming items shall remain with Seller until final acceptance by Buyer. 9. INSURANCE A. Seller shall be solely responsible for any and all third-party liability incurred by it in connection with the performance of this Purchase Order. B

ORION Industries

robotic conformal coating spray solution-PCB magazine loader,PCB turn conveyor,pcb conformal coating

ASCEN Technology | https://www.ascen.ltd/Video_Channel/Non-standard_equipment/597.html

robotic conformal coating spray solution : Non-standard equipment, :2020-02-19 Conformal coating can be applied over the entire PCB surface or in select areas to provide protection from service

ASCEN Technology


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