New SMT Equipment: cooldown profile (10)

High Speed Hot Bar Soldering Machine Bonding PCB And Fpc Board

High Speed Hot Bar Soldering Machine Bonding PCB And Fpc Board

New Equipment | Soldering Robots

Specification For Hot Bar Welding Machine CWPDY 1 . Establish year:1999 2 . lead time:5days 3 . working area:200*260mm 4 . fixture:1set  Specifications : Microprocessor based controller provides precise and consistent temperature control .

ChuangWei Electronic Equipment Manufactory Ltd.

Pulse Heating Hot Bar Soldering Machine Thermode Soldering For PCB Assembly

Pulse Heating Hot Bar Soldering Machine Thermode Soldering For PCB Assembly

New Equipment | Soldering Robots

Microprocessor-based controller provides precise and consistent temperature control.   Unique pulsed heat thermode offers uniform temperature distribution, fast heating and cool-down.   Flexible programmable profiles for targeted idle, preheat and re

ChuangWei Electronic Equipment Manufactory Ltd.

Electronics Forum: cooldown profile (28)

simple doubt about reflow profile

Electronics Forum | Fri Feb 16 13:43:07 EST 2007 | ck_the_flip

Hi Darby, Where did you get the info. that cooling rate is not-as-critical for lead-free? I'm not doubting you, and I actually want this to be the case. We don't have chillers on our ovens, and on fast profiles, we only achieve 2 to 2.5 deg. / s c

Heller 1800S oven profile changing

Electronics Forum | Wed Feb 28 13:02:01 EST 2018 | proceng1

Ours says it needs to cool down, but if I put in into cooldown, I can load the next recipe right away. I don't actually have to wait until it cools.

Industry News: cooldown profile (15)

KIC to Exhibit at SMTA Silicon Valley Expo

Industry News | 2017-11-02 14:36:12.0

KIC announces plans to exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Wednesday, Nov. 29, 2017 at Bestronics, Inc. in San Jose, CA. MB (Marybeth) Allen will showcase how to turn your reflow ovens into a smart ovens with KIC’s eco system comprised of a smart profiler, automatic profiling system and the all new KIC Vantage network insight software.

KIC Thermal

Move toward the future of line connectivity, flexible production, process transparency, machine learning and real-time insight

Industry News | 2017-06-13 20:38:27.0

KIC announces plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 13, 2017 at the Embassy Suites Cleveland Rockside in Independence (Cleveland), OH. MB (Marybeth) Allen will showcase discuss how to turn your factory into a Smart Factory with KIC’s new SPS Smart Profiler reflow process inspection tool and all new KIC Vantage network insight software.

KIC Thermal

Videos: cooldown profile (2)

SMD Soldering of PCBs

SMD Soldering of PCBs

Videos

The LPKF ProtoFlow S reflow oven, with lead free capability, has significant advantages over previous models and rich features including a PC control software package. Learn more: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/solder

LPKF Laser & Electronics

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Official PACE IR 3000 Tutorial - Install and Remove BGA and SMC

Videos

"The IR 3000 offers advanced surface mount rework capability in an integrated, cost-effective, bench-top work station." This video covers the basic processes of the IR 3000, focusing primarily on: Installations, Removals, Component Alignment and Ins

PACE Worldwide

Express Newsletter: cooldown profile (411)

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM

SMT Express, Volume 4, Issue No. 1 - from SMTnet.com

INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured

Partner Websites: cooldown profile (12)

The Generation 4.1 flux management system-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23761&url=_print

. Maintenance of the Generation 4.1 system is very simple. At intervals between 1 month and 1 year the machine should be allowed to run for approximately 1 hour on a factory installed profile that allows the flux separation box to run warmer than flux condensation point

00600-248

Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf

) excessive pad size vs. the part’s terminal size, leading to the same effect. Te m p er at ur e (° C ) Preheat Preflow Reflow Cooldown Dwell at Liquidus 20 to 70 sec Dwell at Liquidus 20 to 60 sec 230 230 220 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 2 to 3 min 3.5 to 4 min 200° to 210°C b. a. Figure 1. The “standard” reflow profile (a

Heller 公司


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