Industry Directory: cooling device (9)

Advanced Cooling Technologies

Industry Directory | Other

A premier thermal management solutions company. Our highly engineered products include Heat Pipes, Heat Exchangers and Cold Plates.

Mechanical Devices

Industry Directory | Consultant / Service Provider / Manufacturer / Other

We develop produce and supply innovative cost effective thermal control units to major Semiconductor Devices Manufacturers to test IC devices -LOW & HIGH Power devices for temp range -65°C to +200°C.

New SMT Equipment: cooling device (98)

Rotary Air Cooling Hotbar Welding Machine 0.4 To 0.6 MPa 2 Set Vaccum

Rotary Air Cooling Hotbar Welding Machine 0.4 To 0.6 MPa 2 Set Vaccum

New Equipment | Depaneling

Hot Bar Soldering Machine Thermode Soldering Machine Hotbar Welding Machine Technical parameters: 1 Power supply: AC220V ± 10%, 50Hz, 3500W 2 Work environment :10-60 ℃, 40% ~ 95% 3 Working pressure: 0.5 ~ 0.7Mpa 4 Welding pressure: 2.5 ~

ChuangWei Electronic Equipment Manufactory Ltd.

Pulse Heating Hot Bar Soldering Machine Thermode Soldering For PCB Assembly

Pulse Heating Hot Bar Soldering Machine Thermode Soldering For PCB Assembly

New Equipment | Soldering Robots

Microprocessor-based controller provides precise and consistent temperature control.   Unique pulsed heat thermode offers uniform temperature distribution, fast heating and cool-down.   Flexible programmable profiles for targeted idle, preheat and re

ChuangWei Electronic Equipment Manufactory Ltd.

Electronics Forum: cooling device (74)

Free programmable device database

Electronics Forum | Thu Feb 06 09:29:43 EST 2003 | EB

Somone sent me a link to this way cool website : http://devicedatabase.dataman.com It has an free online database of programmable devices and microchips and links to free datasheets ........... 8) 8) 8) :D Check it out dudes, EB

Cooling of elctronics

Electronics Forum | Tue Jun 06 18:36:21 EDT 2000 | Mohsen Esmailpour

Which direction is the industry moving to for cooling high-end electronic devices/boards? Is there anything innovative taking place beyond liquid cooling and refrigeration? Is anyone developing cooling techniques which are integral part of the devic

Used SMT Equipment: cooling device (7)

Technical Devices Nu/Flow CV-820

Technical Devices Nu/Flow CV-820

Used SMT Equipment | Soldering - Reflow

Make: Technical Devices Model:  NU/Flow CV-820 Vintage:  2007 Details: •        8 Zones Top and Bottom Heating Zones •        2 Cooling Zones • 

Lewis & Clark

Technical Devices NuEra 18

Technical Devices NuEra 18

Used SMT Equipment | Soldering - Wave

18" Wave Solder Machine New 2014. Lead Free Process Ready Solder Pot;  “Dancer” and Laminar Wave Nozzles; P.I.D. Temperature Control; Low Dross Formation;1000 lb. Solder Capacity. PREHEATER MODULE 2 each 3 foot long Zones; Forc

Petlock Incorporated

Industry News: cooling device (119)

Advances in Heated Dispense Process

Industry News | 2016-06-27 14:59:09.0

GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.

GPD Global

Desktop Systems Provide Flexible Bonding

Industry News | 2003-06-10 08:39:25.0

New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.

SMTnet

Parts & Supplies: cooling device (16)

Siemens 418 00322544-03 NOZZLE

Siemens 418 00322544-03 NOZZLE

Parts & Supplies | SMT Equipment

03003562-02 CAN-BUS1HF:FEED DEVICE3-TRAIL.UNIT INTER    03003563-02 CAN-BUS2HF:COMP.UNIT -SUB-FEED DEVICE4    03003564-01 CAN-BUS 2 HF: FEED DEVICE 4 -F. DEVICE 1    03003565-01 CAN-BUS2HF:FEED DEVICE-PCB-TRAIL. UNIT1    03003704S01 Cooling Hose

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Siemens SIEMENS -  COOLING AIR FILTER .03012701-01

Siemens SIEMENS - COOLING AIR FILTER .03012701-01

Parts & Supplies | Pick and Place/Feeders

SIEMENS -  COOLING AIR FILTER .03012701-01 00326041-01   SONAR PROXIMITY SWITCH INPUT BELT 2 00326042-01   Sonarbero 00326043-01   SONAR PROXIMITY SWITCH OUTPUT BELT 2 00326044-03   Bero Stopper 2 00326056S04  MOTOR WIDTH ADJUSTMENT 2 00326058

QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd

Technical Library: cooling device (6)

Keeping Cool: How Thermal Interface Materials Drive Electronic Innovation

Technical Library | 2025-08-29 13:54:40.0

As the demand for high-performance electronic devices continues to grow, managing heat dissipation effectively has become a critical challenge. Thermal interface materials (TIMs) play a pivotal role in ensuring efficient thermal management by facilitating heat transfer between heat-generating components and heat-dissipating devices. This article examines the various types of TIMs, their application methods, including detailed insights into modern dispensing systems, and the advantages and disadvantages of these methods in the electronics industry.

GPD Global

As Cool as a Cucumber: Managing the Heat Produced by IC Developments

Technical Library | 1999-05-06 10:42:58.0

Many of us tend to think of semiconductors as low power, cool devices. But as the number of transistors in an integrated circuit increases, so does power consumption increases and the need to dissipate the resulting heat load. Microprocessors, in particular, consume more and more power with increase in speed and complexity.

Aavid Thermalloy, LLC

Videos: cooling device (31)

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

How to reduce solder joint voids from 30% to 1%? Try I.C.T Vacuum Reflow Oven

Videos

  · What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine?    · What problems can be solved by smt vacuum reflow soldering machine?   · What is the basic principle of vacuum reflow machine?   · Ho

Dongguan Intercontinental Technology Co., Ltd.

Siemens 418 00322544-03 NOZZLE

Videos

03003562-02 CAN-BUS1HF:FEED DEVICE3-TRAIL.UNIT INTER    03003563-02 CAN-BUS2HF:COMP.UNIT -SUB-FEED DEVICE4    03003564-01 CAN-BUS 2 HF: FEED DEVICE 4 -F. DEVICE 1    03003565-01 CAN-BUS2HF:FEED DEVICE-PCB-TRAIL. UNIT1    03003704S01 Cooling Hose

Qinyi Electronics Co.,Ltd

Career Center - Resumes: cooling device (2)

Masood ur Rehman

Career Center | karachi, Sind Pakistan | Engineering,Production,Quality Control

For Research and Development Centre: --------------------------------------- -Give Recommendations regarding the functionality & operational security aspects in the ongoing projects by analyzing the detailed operations & functions of the product. -Mo

Tim's Resume

Career Center | Temple Hills, Maryland USA | Maintenance,Management,Technical Support

• Installing Network Hardware • Trouble shooting – Hardware and software • System Administration • Procurement Management • Naval Facilities Management • Great Customer Service

Express Newsletter: cooling device (417)

Embedded Thermoelectric Cooling Article

Embedded Thermoelectric Cooling Article Embedded Thermoelectric Cooling Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly

Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process

Partner Websites: cooling device (170)

I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates - I.C

| https://www.smtfactory.com/I-C-T-SMT-Vacuum-Reflow-Oven-Machine-helps-you-to-solve-the-problem-of-High-Solder-Voids-Rates-id45973467.html

. The commonly used insulating materials are tungsten, tantalum, graphite, etc. 3. High performance of water cooling device: when vacuum reflow soldering works, all parts are in the heating state

Thermal Management - Spotlight Thermal Gap Filler

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/thermal-management-spotlight-thermal-gap-filler

. Automotive, 5G infrastructure, data center, consumer electronics, and even private space flight applications – Elon Musk, anyone? –  are driving demand for device cooling and temperature control

ASYMTEK Products | Nordson Electronics Solutions


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