ASCEN-620 Depaneling machine for separating aluminium panel-FR4/CEM-1 The more detail and video please check the link: www.pcb-separator.com For more than 10 years our PCB depaneling machines are developed and improved continuously, in orde
LED reflow oven for 3W high power LED E10 Main product: Reflow oven with 10 zones, hot air reflow oven, SMT equipment, PCB Assembly Equipment, PCB Assembly Equipment, SMD/SMT Assembly, SMT assembly line, automatic production line Heating System &
Electronics Forum | Fri Jan 11 06:38:58 EST 2019 | tirthkar8980
what is the standard for pad size of SMD chip type components
Electronics Forum | Sat Jan 12 01:25:53 EST 2019 | tirthkar8980
Respected sir, thank you so for useful information. Thank you, Tirthkar
Used SMT Equipment | SMD Placement Machines
WE have a GL-541E 1Machine in FUJI for sale. excellent condition.
Used SMT Equipment | SMD Placement Machines
WE have a GL-541E Machine in FUJI for sale. excellent condition.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2003-04-17 11:32:31.0
Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.
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Parts & Supplies | SMD Placement Machines
72A nozzle for SMT machine Yamaha
Parts & Supplies | Pick and Place/Feeders
I-Pulse Nozzle for M1 M2 M4 I-Pulse Nozzle I-Pulse Nozzle for M1 M2 M4 Usage:I-Pulse pick and place machine Product description: I-Pulse Nozzle for M1 M2 M4 Other I-Pulse nozzle in stock: P/N: LG0-M7703-00 Des: Noz
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2008-03-13 13:02:50.0
Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique.
Factory price automatic bare board loaders vacuum pcb loader for smt line APPLICATION The Bare Board Loader is used for automatically loading unpopulated boards at the beginning, or in the middle of a PCB assembly line. The bare boards are l
SMD LED Soldering Machine for SMT Line ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | professional oversea ser
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
KingFei SMT Tech | https://www.smtspare-parts.com/sale-11928258-semi-auto-smd-taping-machine-for-smd-components-packaging-tape-machine.html
Semi-Auto SMD Taping Machine For SMD Components Packaging Tape Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smd-shear
Shear testing is the main test performed for SMD due to component design issues. For example, leadless devices cannot be pull tested as there are no leads to pull upwards and as such must be shear tested to prove their effectiveness
