Electronics Forum | Thu Oct 02 08:26:41 EDT 2008 | rway
We had similar issues until we went to a 6 mil stencil thickness.
Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Industry News | 2007-10-26 13:08:43.0
MORRISVILLE, NC - October 24, 2007 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will highlight the KE-2060RL High-speed Fine-pitch Assembler with IFS-X2 in booth 615 at the upcoming Assembly New England/Nepcon East exhibition and conference scheduled to take place October 30-31, 2007 at the Boston Convention & Exhibit Center.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
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. Coplanarity issues are also prevalent on smaller chip components (i.e.01005), leaded devices and BGA packaged devices. In order to attain the highest level of quality assurance (QA
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