Electronics Forum | Fri Oct 16 12:45:23 EDT 1998 | smd
| | | I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pi
Electronics Forum | Wed Oct 21 21:27:32 EDT 1998 | smd
| | WRONG!!!! | Why do folks still live in this mindset? I'm not slamming you personally. But this is prevalent in our industry. | More opinion: | Make REWORK a nasty, dirty word. Work for the ROOT cause of a process problem. DO NOT ACCEPT rework a
Industry News | 2009-08-04 16:58:23.0
As components get smaller and smaller, managing moisture-sensitive devices and protecting them across the entire supply chain is becoming increasingly important for electronics manufacturers. The goal is to prevent the use of moisture-damaged components at the very start of the SMD process chain.
Industry News | 2014-08-28 12:11:35.0
Vi TECHNOLOGY announces that it will exhibit in Booth #319 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
https://bpmmicro.com/3928-7-site-aps/ The 3928, with up to seven sites, is made for programming large data devices, such as MCUs, eMMC HS400, NAND, NOR and Serial Flash devices. High-speed signals support devices up to 200 Mhz and the latest eMMC
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry
| http://etasmt.com/cc?ID=te_news_bulletin,25161&url=_print
. As in the past, with issues such as ISO 9000 certification and the current ISO 14000 guidelines, the Japanese have led the way. Through a combination of legislative moves and voluntary actions by Japanese manufacturers, several products are currently being offered with a “Green Leaf
