MobilEye develops driving assistance systems based on a single video camera. As a result, there is no need for multiple cameras calibration and synchronization. The novel video analysis algorithms achieve unmatched performance in poor lighting, rain
Electronics Forum | Fri Oct 06 12:58:07 EDT 2006 | cw
hi All, Anyone use snap on type EMI sheilding before? I would like to provide a DFM to a customer who currently have a EMI shield soldered on the boards, which i found this not quite manufacturing friendly as it block the view for inspection, plus re
Electronics Forum | Thu Feb 15 07:47:12 EST 2007 | zanolli
1" long SMT components to be placed without coplanarity issues> Also, what types of finishes are common for the flex;i.e, ENIG, immersion Ag, etc.?
Industry News | 2013-03-19 15:13:22.0
Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.
Industry News | 2020-01-30 09:45:27.0
Embedded World 2020: ARIES Embedded Integrates Industry’s First Multi-Core RISC-V System-on-Chip FPGA
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/combining-2d-and-3d-aoi-the-most-effective-inspection
. Coplanarity issues are also prevalent on smaller chip components (i.e.01005), leaded devices and BGA packaged devices. In order to attain the highest level of quality assurance (QA
| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
. Too much pressure on the placement may also result in bridging defects. (4). Preheat. If the preheating of the equipment does not meet the standard, the temperature rise of the reflow soldering equipment is too fast, which causes the solvent in the solder paste to not completely
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