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Multi-Function Pick and Place machines for Electronic Component KT3050 【Detail】 1.KT3050 is a very practical and powerful full automatic mounter, mounting speed is 6,000 CPH. High precision hardware, imported top brands core parts to ensure p
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Wed May 31 07:55:55 EDT 2017 | buckcho
In IPC it is said that the void % should be established between you and the customer. There is no number. There is only requirement for balls on BGA. I have a customer that agreed to 40% on D-packs which is okay for both us and them.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
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PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation
| https://ipcapexexpo.org/education/call-for-participation
High Speed High Voltage (for Automotive Applications) Microvia Design and Testing PCB/Pad Repair RF Materials Signal Integrity Solderability Surface Finishes Via Plugging and Other Protection Technical Conference Submit Technical Paper Abstract Requirements for Submission Provide an abstract of approximately 300 words that
