Industry Directory | Consultant / Service Provider / Manufacturer
We are a premier TAPE AND REEL service. We have extensive capabilities for your SMT and Through Hole components. Also I.C. PROGRAMMING including flash memory. First articles provided free of charge.
Industry Directory | Manufacturer
Data I/O is the world's leading provider of manual and automated programming solutions for semiconductor (IC) devices. Data I/O's solutions, software and programming engine ensures devices are programmed correctly every time.
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
New Equipment | Board Handling - Conveyors
Detailed Product Description Capacity: 726L Outside size: W600*D700*H1885mm Inside size: W596*D670*H1827mm RH range: 1%-40%RH Display: Microcomputer LCD display Shelves: 5 Power consumption: av 48W Voltage: 110-220V Charact
Electronics Forum | Fri Sep 23 06:42:08 EDT 2005 | lloyd
The only issues I have had in the past with the shuttle are 1. The transport conveyor into the machine was not aligned correctly causing pickup issue from the belt. 2. Operators not correctly loading parts in trays or updating the qty's, this meant
Electronics Forum | Tue May 25 13:03:35 EDT 2010 | jdumont
Hello, I have no experience with CE-1155 but a ton with 1B73. I would say Justin hit it right on the head. 1B73 does not like to be anywhere near silicone residues. We make sure the boards are handled with gloves after wash, before coat. Unfortunat
Used SMT Equipment | Pick and Place/Feeders
Modern high performance Manncorp / Autotronik pick and place machine with 60 electronic smart feeders. The current model is the MA392v1 or BA392v1 and both have a base price of around 70,000.00. It is my understanding that this machine has all the sa
Used SMT Equipment | Pick and Place/Feeders
Siemens X4 4 x IC head for sale. Welcome to contact if intersted. Demon machine
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2016-09-15 18:08:04.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Parts & Supplies | Assembly Accessories
Juki KSUN SMT FEEDER COVER with Unit More SMT JUKI feeder parts in stock E1506706000 Juki Feeder Spring E2300706000 JUKI 16MM Feeder Spring E3245760000 JUKI Ratchet SP 32MM Feeder Spring E3306706000A JUKI FF 12MM Feeder Winding Reel
Parts & Supplies | Assembly Accessories
YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) YAMAHA YV100II 32#NOZZLE For IC of tiny size YAMAHA YV100II 39#NOZZLE 0603 "O" hole YAMAHA YV100II 33#NOZZLE For IC YAMAHA YV100II 34#NOZZLE For IC YAMAHA YV100II 35#NOZZLE For diode YAMAHA YV100I
Technical Library | 2019-08-14 08:27:46.0
There are five forms of carrier tape sealing cracking. In particular, it is more important to seal products such as IC components (IC tape carriers) and lighter and thinner LED components (LED tape carriers).
Technical Library | 2014-08-19 16:04:28.0
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly.
Data I/O's premier automated programming system PSV7000 with tray to tray integrated media I/O option for semiconductor devices
https://bpmmicro.com/3928-7-site-aps/ The 3928, with up to seven sites, is made for programming large data devices, such as MCUs, eMMC HS400, NAND, NOR and Serial Flash devices. High-speed signals support devices up to 200 Mhz and the latest eMMC
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/tpic2050rdfdrg4-ic-204319?page=84&category=1111
PANASONIC IC TPIC2050RDFDRG4 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products AI SPARE PARTS IC Public Pricelist Public Pricelist IC
KingFei SMT Tech | https://www.smtspare-parts.com/sale-14256003-samsung-sm320-single-ic-tray-double-side-sm-ic-tray-l565-w350mm.html
Samsung SM320 Single IC Tray Double Side SM IC Tray L565*W350mm Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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