Industry Directory | Manufacturer
Manufacturer of PCB laminates. The products includes full series of FR-4 copper clad laminates, prepreg,CEM-1,CEM-3, etc.
Industry Directory | Distributor
Suppliers to the PCB Industry with a huge range of products including copper clad laminates, drill boards and consumables.
基板类型：氧化铝陶瓷基板材料厚度：0.635mm导电层：Cu，Ni，Au金属层厚度：300um表面处理：浸金单面/双面金属：单面镀铜通孔：否阻焊层：否 1。.精度高，电热性能好，插入强度高。2。焊接性好，可实现盲孔通孔。3。技术成熟，环保，无污染，成本低于传统技术。4。应用范围广，可5。定制生产，无需开模，生产周期短。
合金镀层：陶瓷制造工艺材料厚度：0.635mm导电层：Cu，Ni，Au金属层厚度：300um 表面处理：浸金单面/双面金属：单镀铜通孔：否焊焊层：否 1..精高，电热性能好，补充强度高。2。焊接性好，可实现盲孔通孔。3。技术成熟，环保，无污染，成本训练传统技术。4。应用范围广，可5。定制生产，无需开模，生产周期短。
Electronics Forum | Thu Nov 08 22:27:52 EST 2007 | jkhiew
Did the PTH barrel ends in massive copper clad ? If yes this type of poor thermal layout topside heating is often recommended.
Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2003-04-04 08:21:57.0
The deal emphasizes PIAD�s commitment to being a major supplier to the UK printed circuit market and enhances Crossley & Bradley�s position as a leading distributor of copper-clad laminates in the UK
Parts & Supplies | Assembly Accessories
PC12P Inventory Material: Copper Clad FR4, Single Sided, 2 oz. Series: - Size Dimension: 18.00" x 12.00" (457.4mm x 304.8mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: Copper Clad, Positive Sensitized PC12P-E RFQ
Parts & Supplies | Board Cleaners
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Technical Library | 2021-03-04 15:22:33.0
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4- phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1.
Technical Library | 2017-08-24 16:53:20.0
With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In addition to the increasingly high performance requirements of CCL's, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics. (...) This paper introduces a new phosphonate oligomer which can be used as a reactive flame retardant in epoxy based resin systems. Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented.
In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com
SMTnet Express, August 24, 2017, Subscribers: 30,744, Companies: 10,648, Users: 23,699 Development of Halogen Free, Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer Dr. Lawino Kagumba - FRX Polymers Inc. ., Yang Zhong Qiang
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
ORION Industries | http://orionindustries.com/pdfs/X300-series.pdf
.) Class All Properties Polybutylene terephthalate (PBT) - clad aluminum, copper or tin-plated copper . EM-1305 NC Al 0.002 0.009 94V-2 50 EM-2305 NC Cu 0.002
