Industry Directory | Consultant / Service Provider / Manufacturer
U.S. based contract manufacturer providing turn-key EMS solutions to defense and commercial OEM's.
New Equipment | Education/Training
The areas in which we are conducting research comprise a comprehensive group of inter-related issues and concerns involving all military, industrial and commercial electronics users facing conversion to lead free solder alloys. REI’s DoD currently
New Equipment | Solder Materials
Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price
Industry News | 2015-01-07 15:52:18.0
The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Industry News | 2009-04-15 23:01:13.0
BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Technical Library | 2009-02-13 12:29:39.0
To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums SMT Equipment Company Directory Calendar Career
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums SMT Equipment Company Directory Calendar Career
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Alloy A substance composed of two or more metal elements. Example: Sn96.5 Ag3.0 Cu0.5 is 96.5% Tin, 3.0% Silver, and 0.5% Copper. Generally, alloys will have different properties than those exhibited by their individual elements (e.g
