Industry Directory: copper dissolution (1)

Rosebud Electronics Integration Corp.

Industry Directory | Consultant / Service Provider / Manufacturer

U.S. based contract manufacturer providing turn-key EMS solutions to defense and commercial OEM's.

New SMT Equipment: copper dissolution (3)

Research – Tin Whiskers, Copper Dissolution, Legacy

Research – Tin Whiskers, Copper Dissolution, Legacy

New Equipment | Education/Training

The areas in which we are conducting research comprise a comprehensive group of inter-related issues and concerns involving all military, industrial and commercial electronics users facing conversion to lead free solder alloys. REI’s DoD currently

Rosebud Electronics Integration Corp.

Balver Zinn Alloys

Balver Zinn Alloys

New Equipment | Solder Materials

Bars / Solid Wires Proposal Pro Contra Wave and selective soldering SN100C® Favourable price

Balver Zinn

Electronics Forum: copper dissolution (68)

Cu dissolution PTH

Electronics Forum | Wed Apr 26 02:16:18 EDT 2006 | AR

We had x-ray and optical microscopy analyses done on transformers dip soldered with Sn/Pb, SN100C3 and SN100C4 alloys using temperatures 400�C ... 450 �C, with dip times of 2..4 seconds. We found that SN100C4 is at least as good as Sn/Pb 62/38 and SN

Cu dissolution PTH

Electronics Forum | Tue Jul 05 11:00:37 EDT 2005 | patrickbruneel

Inds, This will happen with all lead-free alloys having a tin content above 70%. It takes about 30 sec. for a molten lead-free alloy to totally dissolve a copper pad. The higher the temperature the shorter the time and visa versa. The scary part of

Industry News: copper dissolution (27)

SMTA International 2014 Best Papers Announced

Industry News | 2015-01-07 15:52:18.0

The SMTA is pleased to announce the Best Papers from SMTA International 2014. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.

Surface Mount Technology Association (SMTA)

IPC Honors Best Papers at IPC APEX EXPO� 2009

Industry News | 2009-04-15 23:01:13.0

BANNOCKBURN, Ill., USA, April 2, 2009 � IPC � IPC � Association Connecting Electronics Industries� has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO, held March 31�April 2, 2009 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

Technical Library: copper dissolution (7)

A Study of Lead-Free Wave Soldering

Technical Library | 2007-05-02 15:00:17.0

This brief study of lead-free wave soldering focuses upon copper dissolution and solder maintenance issues. Unfortunately, it is determined that waste and changeover costs can dramatically increase with lead-free wave soldering.

AIM Solder

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Technical Library | 2009-02-13 12:29:39.0

To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering

Kester

Videos: copper dissolution (1)

Electrovert's  DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind.  The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.  This

Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave. This

Videos

Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.

ITW EAE

Express Newsletter: copper dissolution (151)

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control If you don't see images, please visit online version at: http://www.smtnet.com/express/ News   Forums   SMT Equipment   Company Directory Calendar   Career

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control If you don't see images, please visit online version at: http://www.smtnet.com/express/ News   Forums   SMT Equipment   Company Directory Calendar   Career

Partner Websites: copper dissolution (12)


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