Industry Directory: copper electroplating (1)

HQ NextPCB

Industry Directory | Distributor / Manufacturer

Top 20 High-Quality PCB Fabrication and one-stop Turnkey PCB Assembly Facilities worldwide. Served national engineers for over 15 years, becoming a household name in providing full-feature multilayer PCBs engineers can trust.

New SMT Equipment: copper electroplating (8)

Thick-Copper PCB

Thick-Copper PCB

New Equipment | Assembly Services

Thick-Copper PCB Material: Fr-4 Layer Count: 4 layers PCB Thickness: 1.4mm Min. Trace / Space Outer: 0.065mm Min. Drilled Hole: 0.2mm Via Process: Tenting Vias Surface Finish: ENIG Product Features Features: 1) Years of experience in half-

NextPCB-Reliable Multilayer Boards Manufacturer

PHASCOPE® PMP10 for Measuring Coatings on PC Boards

PHASCOPE® PMP10 for Measuring Coatings on PC Boards

New Equipment | Test Equipment

The hand-held PHASCOPE® PMP10 is ideally suited for quality control in the electroplating and printed circuit board (PCB) industries. Because the instrument employs the phase-sensitive eddy current method (ISO 21 968), it allows the measurement of me

Fischer Technology, Inc.

Electronics Forum: copper electroplating (33)

Re: copper land delamination

Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F

Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l

Re: Shielding

Electronics Forum | Thu Mar 04 17:10:19 EST 1999 | Earl Moon

| Our vendor proposed to supply us with shields made out of Cold Rolled Steel (CRS) electroplated with Sn (50 - 150 minches). Should I be concerned with solderability or are there a better alternatives to tin finish? | No matter the base metal, elec

Industry News: copper electroplating (10)

PCB Technology Challenges Discussed at SMTA International

Industry News | 2011-10-03 15:37:21.0

The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International

Surface Mount Technology Association (SMTA)

Best Technical Paper at IPC APEX EXPO Selected

Industry News | 2015-02-15 17:55:40.0

The best technical conference paper of IPC APEX EXPO 2015 has been selected. Voted on through a ballot process by members of IPC’s Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 24.

Association Connecting Electronics Industries (IPC)

Technical Library: copper electroplating (9)

Copper Electroplating Technology for Microvia Filling

Technical Library | 2021-05-26 00:53:26.0

This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.

Rohm and Haas/Advanced Materials

Factors Affecting the Adhesion of Thin Film Copper on Polyimide

Technical Library | 2017-11-22 12:38:51.0

The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.

Intrinsiq Materials Inc.

Videos: copper electroplating (1)

Resin plug application and process

Videos

With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr

Headpcb

Events Calendar: copper electroplating (2)

Auburn University Student Chapter Event: Get Hired in Electronics Industry

Events Calendar | Fri Apr 16 00:00:00 EDT 2021 - Fri Apr 16 00:00:00 EDT 2021 | ,

Auburn University Student Chapter Event: Get Hired in Electronics Industry

Surface Mount Technology Association (SMTA)

Qualification and Reliability of Microvias

Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,

Qualification and Reliability of Microvias

CALCE Center for Advanced Life Cycle Engineering

Express Newsletter: copper electroplating (156)

SMTnet Express - May 27, 2021

SMTnet Express, May 27, 2021, Subscribers: 27,090, Companies: 11,365, Users: 26,673 Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook The electronics industry is further

SMTnet Express - May 12, 2022

SMTnet Express, May 12, 2022, Subscribers: 25,588, Companies: 11,569, Users: 27,213 Electronics Manufacturing Technical Articles Filling of Microvias and Through Holes by Electrolytic Copper Plating –Current Status and Future

Partner Websites: copper electroplating (10)

What is the PCB Fabrication Process? | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-the-pcb-fabrication-process/

. Once removed, a thin coating of copper is deposited on all exposed parts of a panel, creating a metallic base for the electroplating process

Imagineering, Inc.

Pan Pac 2020 Program

Surface Mount Technology Association (SMTA) | https://www.smta.org/panpac/Pan-Pacific-2020-Program.pdf?v=20060405647

., Auburn University Copper Electrodeposition by Hydrogen Evolution Assisted (HEA) Electroplating for Wearable Electronics Sabrina Rosa-Ortiz, University of South Florida Glass Panel Packaging as the Most Leading-Edge Packaging: R

Surface Mount Technology Association (SMTA)


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