We have tremendous experience in using various software tools to meet your project requirements. During the development of your product, we work closely with your electrical engineers and mechanical engineers to ensure that the placement of the part
Our MW Series of ultra soft-fabric wrapped shielding profiles utilises a highly conductive and durable impregnated fabric formed around a sponge or foam core to create a very versatile low compression gasket medium Our MF Series is a range of highl
Electronics Forum | Thu May 09 17:19:28 EDT 2002 | davef
Can�t help you with the article that you read. Other places to start are: * 2221, 7.2 Heat Dissipation Considerations, 7.3 Heat Transfer Techniques, and 8.1.10 Heat Dissipation * 2222, 9.1.2 Thermal Relief In Conductor Planes
Electronics Forum | Fri Jun 06 18:44:26 EDT 2003 | davef
No, no. It's koscher to have thermal planes. You just need to: * Work with your fabricator to keep the layup balanced. * Relieve the plane so that it doesn't cause assembly problems. While probably not directly for your part, it gives a starting p
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2023-10-23 09:44:34.0
Changes address advances in rigid printed board fabrication processes
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Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
In the world of makers, people enjoy the fun of designing and developing hardware/ software, even final electronic products. They will not concentrate a lot on the cost and manufacturability. But it is quite different from lab to factory, when it com
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-reduce-emi-in-printed-circuit-boards/
. Since all PCBs need a ground plane in order to function, it’s an easy first step when implementing noise-reducing strategies. A ground plane functions as a return path for current across the board, and is typically made from a thin layer of copper foil
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/industries/electronics-assembly-and-packaging?page=2
. Both manual and fully automatic testing solutions provide highest accuracy combined with intuitive and user friendly interface. Nordson DAGE Jade, Ruby and Diamond X-ray inspection systems with CT and large board CT (X-Plane
