Industry Directory: copper residue (4)

MEC Company Ltd.

Industry Directory | Manufacturer

R&D, production and sales of chemicals, equipment and related materials used in the production of PCB

Lost River Products Company

Industry Directory | Manufacturer

soldermask, temporary, water soluble

New SMT Equipment: copper residue (8)

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

Kapp Copper-Bond Flux - High Temperature Soldering Flux

Kapp Copper-Bond Flux - High Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien

Kapp Alloy & Wire, Inc

Electronics Forum: copper residue (73)

contamination on copper

Electronics Forum | Thu Apr 15 08:23:47 EDT 2004 | prod

hi, Having put a copper socket trough a wave soldering machine, and then through a DI wash, the boards have been dried and after a few days a green residue has been noticed on the copper. any suggestions? not drying properly maybe? or could it be th

contamination on copper

Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel

Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n

Industry News: copper residue (101)

IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference

Industry News | 2017-04-11 21:32:40.0

SMTA and SMART Group announce experts from IBM Corporation and Siemens AG will keynote the Contamination, Cleaning and Coating Conference. The conference is scheduled May 22-24, 2017 at the Radisson Blu Airport Hotel in Amsterdam.

Surface Mount Technology Association (SMTA)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

Technical Library: copper residue (3)

Recycling of Non-metallic Residue from Waste Printed Circuit Boards to Produce Interlocking Concrete Blocks

Technical Library | 2022-01-05 23:14:20.0

The process of copper recovery from waste printed circuit board has generated large amounts of non-metallic fraction (NMF) residue. In this research, the residue was recycled as a substitute for fine aggregates at 0%, 5%, 10%, 15%, and 20% to produce interlocking concrete blocks. Properties of the interlocking concrete blocks produced in this study, such as density, water absorption, compressive strength, were firstly examined and the selected mixes were further evaluated for the heavy metal leachability.

Mahidol University

How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR?

Technical Library | 2016-09-08 16:27:49.0

In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.

Foresite Inc.

Videos: copper residue (8)

Guillotine type flexible pcb board cutting separator machine for copper keyboard fiberglass pcb

Guillotine type flexible pcb board cutting separator machine for copper keyboard fiberglass pcb

Videos

Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to

Shenzhen Honreal Technology Co.,Ltd

auto pcb screen printer, auto smt stencil printer , auto solder paste printer , stencil printing machine, PCB solder paste printer

auto pcb screen printer, auto smt stencil printer , auto solder paste printer , stencil printing machine, PCB solder paste printer

Videos

https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main

ASCEN Technology

Events Calendar: copper residue (1)

CALCE Reliability Science Symposium - Spring 2020

Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA

CALCE Reliability Science Symposium - Spring 2020

CALCE Center for Advanced Life Cycle Engineering

Express Newsletter: copper residue (285)

Partner Websites: copper residue (37)

Desoldering Braid, Quick Braid, .075" x 100'

| https://pcbasupplies.com/desoldering-braid-quick-braid-075-x-100/

: EasyBraid Description Additional information Description DESOLDERING BRAID, QUICK BRAID, .075″ X 100′ Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics Easily removes solder from components or pads on a circuit board Concentrated fine copper


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