Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
New Equipment | Solder Materials
The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper
Flake & Powders for die-Attach adhesives and thick film inks. (Silver, Copper, Silver-Palladium, Platinum)
Electronics Forum | Thu Aug 29 17:51:43 EDT 2002 | nifhail
I have seen several Imm Ag pad on the assembled board which have a copper colorleaching through the silver plating This happened on the pad which was not deposited with paste during the assembly process. Don't know if it is a problem, but we only h
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Industry News | 2003-02-07 09:13:12.0
The Sessions Covered Current and Emerging Technologies
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
Parts & Supplies | General Purpose Equipment
The conductive elastomer have good conductive,and the products are mainly used in army electronic equipments like spaceflight,aviation,ect. We can produce this products according the drawing supplied by our customers. The materials: Silicon with Si
Technical Library | 2012-10-23 14:25:38.0
Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.
Technical Library | 2009-01-15 00:42:58.0
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.
Paramount Enterprises with a renowned brand PARENTNashik is an ISO 9001:2015 certified company, listed in major leading manufacturers, suppliers & exporters of resistance spot welding consumables, spares, weldparts in Nashik – India. PARENTNashik is
Paramount Enterprises with a renowned brand PARENTNashik is an ISO 9001:2015 certified company, listed in major leading manufacturers, suppliers & exporters of resistance spot welding consumables, spares, weldparts in Nashik – India. PARENTNashik is
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
– Tin Silver Vs. Tin Silver Copper Antimony • With .5% Antimony – Cold temperature stability is enhanced – Reduced Copper intermetallics
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
(HDI) Finish Hole Size • Mechanical Drill - 4 mil (HDI) • Laser Drill - 2.5 mil (HDI) True Hole Position +/-.0015" Finish Hole Size Tolerance • PTH - +/-.0015" • Non-PTH - +/-.001" Aspect Ratio (Board Tks./FHS) 30 Heavy Copper
