Industry Directory | Manufacturer
R&D, production and sales of chemicals, equipment and related materials used in the production of PCB
Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
New Equipment | Fabrication Services
Hitechpcb is a professional manufacturer of copper based printed circuit board (PCB). We produce metal-based MCPCB, aluminum substrate and copper substrate PCBs. with short delivery time, strict quality and excellent service. What is Copper Based PCB
To shield against emissions, there must be a barrier of an electrical conductive material. Shielding laminates provide an economical and effective solution to this problem. Most of our materials consist of a metal foil (usually, copper or aluminum)
Electronics Forum | Thu Aug 12 00:17:15 EDT 1999 | DLKearns
Wanted to know if there was a good "to go by" tip other than the customers(if it helps current req.,10% of 30% of trace) requirements, about pits in the traces on copper plated ceramic substrates? More to the point how many is too many regardless of
Electronics Forum | Mon Nov 15 14:40:38 EST 1999 | Bob Smith
Hi, I have a problem I've never seen before so I hope someone here can help. A recent batch of PCBs arrived where the copper lands delaminate with a small pull. Normally you have to pull pretty hard and the whole land comes off the substrate. These
Industry News | 2019-01-30 08:13:02.0
The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.
Technical Library | 2023-05-10 01:39:38.0
DPC (DirectPlatingCopper) thin film process is a method of prepare copper film using magnetron sputtering technology. This process is a process in which the copper target with the target material is placed in a true cavity chamber, and plasma is generated on the copper target surface by magnetron sputtering technology. The ions in the plasma are bombarded on the surface of the target, which is sputtered into fine particles and deposited on the substrate to form a copper film.
Technical Library | 2010-07-08 19:49:59.0
Aging characteristics of new lead free solder alloys are in question by many experts because of higher amount of tin’s effect on the diffusion of other metals, primarily copper, to create undesirable boundary intermetallics over long periods of time and even moderately elevated temperatures. A primary layer of intermetallics, Cu6Sn5 forms as the liquid solder makes contact with the solid copper substrate. This reaction however ceases as the solder temperature falls below that of liquidus. A secondary intermetallic Cu3Sn1, an undesirable weak and brittle layer, is thought to form over time and may be accelerated by even mildly elevated temperatures in electronic modules such as laptops under power. This project was designed to quantify the growth rate of Cu3Sn1 over an extended period of time in a thermal environment similar to a laptop in the power on mode.
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Events Calendar | Wed Jul 03 00:00:00 EDT 2024 - Wed Jul 03 00:00:00 EDT 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper
SMTnet Express, April 20, 2017, Subscribers: 30,402, Companies: 10,575, Users: 23,153 High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor
| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1066-voids-in-solder
. The image was generated at 50 MHz by focusing through the copper base to the copper base/ceramic substrate interface. Result The black areas observed in the substrate regions (multi-colored areas
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