Industry Directory | Distributor
Suppliers to the PCB Industry with a huge range of products including copper clad laminates, drill boards and consumables.
Industry Directory | Consultant / Service Provider / Manufacturer
EMS company Laser SMT stencils mfg Tape converting , slitting , die cut Laser modules mfg Distribution materials,components ISO 9001:2015 ISO 13485:2016 AQAP 2110:2016 EN 9120:2018
Adhesiveless Single-Sided Copper Clad Laminate-- 2 Layer FCCL Adhesiveless Double-Sided Copper Clad Laminate-- 2 Layer FCCL FCCL-TD-W, FCCL-TD-A (Double) Product Characteristics: 1.Excellent heat resistance and chemical resistance 2.High
Composite Lithium-ion Battery Copper Foil Composite Lithium-ion Battery Copper Foil CTD-FEC is an electrolytic copper foil for lithium-ion batteries independently. Compared with traditional lithium-ion battery copper foil, composite lithium-ion bat
Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
Electronics Forum | Tue Dec 09 18:03:39 EST 2008 | davef
First, you cannot determine foil thickness from its weight per area, because there is significant variation in the density of electrodeposited copper. Second, the official IPC specification for minimum thickness is "after" processing by the fabricat
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2010-04-12 16:09:04.0
RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.
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Parts & Supplies | Pick and Place/Feeders
FUJI part KX0547 Other FUJI parts: W1021A WASHER, LOCK spring pad AA6AR06 SPROCKET Coil with pinion H4443A BEARING, MINIATURE bearing PM046C4 GEAR pinion PM08BZ2 COLLAR, SPACER pinion washer PP02591 SPROCKET pinion steel teeth PZ53330 MAGNET
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Parts & Supplies | Pick and Place/Feeders
FUJI part gear PT01862 Other FUJI parts: W1021A WASHER, LOCK spring pad AA6AR06 SPROCKET Coil with pinion H4443A BEARING, MINIATURE bearing PM046C4 GEAR pinion PM08BZ2 COLLAR, SPACER pinion washer PP02591 SPROCKET pinion steel teeth PZ53330 M
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
SMTnet Express, April 30, 2015, Subscribers: 22,686, Members: Companies: 14,334 , Users: 38,119 Signal Transmission Loss due to Copper Surface Roughness in High-Frequency Region Elaine Liew; Mitsui Copper Foil Malaysia, Shah Alam Malaysia, Taka
SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082 Factors Affecting the Adhesion of Thin Film Copper on Polyimide David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc. The use of copper
ORION Industries | http://orionindustries.com/pdfs/X700-series.pdf
: Aluminum, Copper, Tin Plated Copper (SnCu) Standard Gauges (Foil): 0.002”, 0.005” EMI/RFI SHIELDING LAMINATES EM-X700 Series Product Data DESCRIPTION
Imagineering, Inc. | https://www.pcbnet.com/blog/when-to-use-fr4-printed-circuit-boards/
180ºC. In PCB manufacturing a thin layer of FR4 is typically laminated with copper foil layers. What are the Types of FR4? There are many variations of FR4 used in PCBs
