Industry Directory | Manufacturer
Auspi Enterprises Co., Ltd., one of the professional suppliers of printed circuits in China. We found your company info on the web knowing that you're dealing with electronics, which we think you may have demand on pcbs.
MMCC manufacturers light weight, high conductivity, low expansion graphite fiber reinforced aluminum and copper alloys. These alloys are fast machining, non magnetic, non toxic, and are easily plated. CTE's from 3-15 ppm/C and K's from 180-300 W/mK.
Dual Lane SMT Reflow Oven Nitrogen soldering process dual rail conveyor Weight Appx.:3060Kg Dimension 6300*1680*1530mm Product description: 10 Zones Dual Rail Nitrogen SMT Reflow Oven KTR-1000D-N Manufacturer, Nitrogen soldering process, dual
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
Electronics Forum | Sun Sep 09 21:59:36 EDT 2018 | sanneyyu
we are a PCB house, you can add some patterns at breaktabs or board edge, this can help you easily verify copper weight for every circuit layer.
Electronics Forum | Tue Apr 24 09:19:51 EDT 2018 | vetteboy86
Is there a preferred method among printed circuit board assembly for accurately and quickly verifying the copper weight of a printed circuit board? I would like a tool and process that our quality inspector could quickly use to verify upon receipt of
Used SMT Equipment | SPI / Solder Paste Inspection
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Used SMT Equipment | Depanelizers / Routers
Jot Automation J501-57 (2010) Laser Depaneling Cell Brand: Jot Automation Model: J501-57 Year: 2010 Description: Laser Depaneling Cell Standard Features • CO2 laser • Cutting beam from top side • Cutting nozzle moved by upper robot axes •
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 5 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Immersion gold over nickle
Parts & Supplies | Circuit Board Assembly Products
1) 36*36mm/1up, Aluminium type: A5052 2) Thermal conductivity: 0.8-1.3 W/mk, 3) Single sided, 1.6mm 4) White solder mask/ Black Legend 5) Copper weight: 35μm 6) Surface Finish: ENIG 7) Profile: Punch
Technical Library | 2018-07-18 16:28:26.0
Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented
Technical Library | 2021-03-04 15:22:33.0
Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4- phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1.
Guillotine type V-cut PCB Cutting Machine Product Description 1. For internal strength generates during separation, Minimize it to value under 180uE ,to avoid solder crack or component damage 2. Able to separate edge of V-slot, minimum distance to
Metal Board V-cut PCB Depaneling Machine Guillotine PCB Cutter Features: 1. Less stress ,high cutting quality 2. Suitable for cutting all kinds of PCB material, even for Aluminum and copper material PCBs. 3. Security:the cutting opening is 2mm t
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page A New Light-Weight Electronic Packaging Technology Based On Spray-Formed Silicon-Aluminiumby David M. Jacobson
| http://etasmt.com/cc?ID=te_news_industry,24565&url=_print
? The answer is absolutely NO! The PCB thermal capacity is different according to the material type, thickness, copper weight and even the shape of the board
| https://pcbasupplies.com/anti-static-1/
|Manncorp Automation Tooling ezCLIP Component Handling Cut Tape Handling COT Stripfeeders Mini COT Stripfeeders V2 Light Weight Stripfeeders QuickTray Soldering Robots PCB Support Systems ezLOAD 120
