Lead Tinning is an important aspect when components need to withstand adverse conditions for extended periods. Lead Tinning can also be used in the restoration of corroded components to their original condition. V-TEK meets or exceeds Mil standards.
Methods in accordance with PRO-STD-001, SAE AS 5553, and SAE AS 6081. Process follows ISO/DIS 12931. Datest tools and training are used to detect packaging damage; ESD compliance violations; falsified or altered documentation; tampered part markin
Electronics Forum | Thu Jan 05 12:06:12 EST 2006 | Rob
It wasn't corroding the stencil, it was corroding the cleaning fluid system.
Electronics Forum | Thu Aug 17 08:38:21 EDT 2006 | pjc
Any materials that come in contact with the flux should be made from stainless steel, titanium, or plastics. These materials will not corrode from OA fluxes. Overspray is an issue. I think Pillerhouse has that jet fluxer, so I don�t think there is mu
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2011-05-06 21:39:30.0
Kyzen announces that Phil Zhang, its China Sales Manager, will present twice during the upcoming SMTA China East conference, which is being held in conjunction with NEPCON China 2011.
Technical Library | 2019-05-23 10:42:00.0
Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may precipitate along electromagnetic field lines and form dendritic shorts. In addition, the presence of residue can alter the insulation properties of a board, affect the adhesion of the conformal coating, or interfere with the moving parts of the assembly. In radio frequency (RF) applications, flux may change the RF properties on the surface of the printed circuit board (PCB) such as the dielectric strength, surface resistance, and Q-resonance.
Technical Library | 2019-09-27 09:14:41.0
One of the most critical factors in preventing corrosion from occurring in electronics is maintaining the state of cleanliness. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1] So, to prevent corrosion from occurring, either the material or the chemical environment must be adjusted. Adjusting the material usually means application of a protective coating or replacing a more reactive material with a less reactive material. Adjusting the chemical environment usually means removing ionic species through cleaning, and removing moisture, usually with a conformal coating or hermetic package. Ionic species and moisture are problematic because they form an electrolyte which is able to conduct ions and electricity. Any metal that comes into contact with the electrolyte can begin to corrode.
Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Tue Feb 18 00:00:00 EST 2020 | ,
Corrosion Testing For Electronic Equipment
Heller Industries Inc. | https://hellerindustries.com/searchqueries/
soldering reflow circuit board reflow cold solder joints reflow company reflow cooling rate reflow corroded solder joints reflow dom reflow double sided chip reflow electronics reflow epoxy reflow
| https://ipcapexexpo.org/exhibitors/contract-general-rules-regulations
. Caps and plugs. Caps and plugs required on containers and cylinders when not in use. Leaks, damage or corrosion. Leaking, damaged or corroded compressed gas containers, cylinders and tanks shall be removed from service by approved qualified persons
