New SMT Equipment: corrosion in smd metal part (1)

Passive SMD Magnetic Buzzer ab epoxy potting machine

Passive SMD Magnetic Buzzer ab epoxy potting machine

New Equipment | Dispensing

Passive SMD Magnetic Buzzer ab epoxy potting machine Product Description 2 component polyurethane injection resin machine dispensing machine for pu compound Where to buy PU , epoxy bonding machine ? We Daheng Automation specialize in different ty

Guangzhou Daheng Automation Equipment Co.,LTD

Industry News: corrosion in smd metal part (5)

Kyzen to Participate in Cemconex 2008 Exhibition and Conference

Industry News | 2008-10-07 19:14:19.0

NASHVILLE � October 2008 � Kyzen, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will exhibit AQUANOX� A4241 PCB and Stencil Cleaner at the tabletop Cemconex exhibition and will present a paper during the conference. Cemconex is scheduled to take place October 17, 2008 in Timisoara, Romania.

KYZEN Corporation

KYZEN to Display Industrial Parts Cleaners at the Top Automotive Remanufacturing Show in the U.S.

Industry News | 2014-10-12 18:49:20.0

KYZEN announces that it will exhibit in Booth #B422 at BigR/ReMaTecUSA, scheduled to take place Nov. 1-3, 2014 in Las Vegas, NV.

KYZEN Corporation

Technical Library: corrosion in smd metal part (2)

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2023-11-14 19:24:08.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations.

Vitronics Soltec

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2021-09-29 13:35:21.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.

Vitronics Soltec

Express Newsletter: corrosion in smd metal part (730)

SMTnet Express - May 10, 2018

(PCBs) is the corrosion of copper metallization and

SMTnet Express - May 26, 2016

inhibitors in component and PCB metallizations.

Partner Websites: corrosion in smd metal part (344)


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SMT feeders

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Potting and Encapsulation Dispensing

Smt Feeder repair service centers in Europe, North, South America
PCB Handling Machine with CE

We offer SMT Nozzles, feeders and spare parts globally. Find out more
Voidless Reflow Soldering

High Precision Fluid Dispensers
High Throughput Reflow Oven

Wave Soldering 101 Training Course