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New Equipment | Cleaning Equipment
Fully Automatic Stencil Cleaning System BMP-750 Features ▶All stainless steel body, beautiful, wear resistance, corrosion resistance, in line with environmental protection requirements and standards. ▶The fully pneumatic operation, no electricity, t
New Equipment | Cleaning Equipment
Automatick Ultrasonic Stencil Cleaner BMP-1200 ▶All stainless steel body: beautiful, wear resistance, corrosion resistance, acid, alkaline and other cleaning fluid. Meet environmental protection requirements and standards. ▶Full pneumatic operation,
Electronics Forum | Thu Oct 28 11:41:21 EDT 2004 | Steve Stach
Hello Loz, Blue residues on circuit boards can be caused by copper corrosion, component body deterioration, marking permanently, and adhesive break down. In this case, a more subtle mechanism appears to be possible. This is a no clean application
Electronics Forum | Mon May 26 09:31:41 EDT 2008 | davef
What steps are taken in low residue wave soldering to assure the proper amount of flux is applied prior to soldering? * Too little flux can result in poor solder flow. * Too much flux can result in corrosive residues left on the board after soldering
Industry News | 2012-11-02 09:04:14.0
IPC and SMTA jointly announce the agenda for Session 5 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2016-10-13 16:00:08.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Parts & Supplies | Tape and Reel
High Temperature Masking dots High temperature masking tape and dots are ideal for masking gold fingers of printed circuit boards during wave solder or solder dip process, as well as for solder wave masking and electrical insulation. The p
Technical Library | 2015-07-16 17:24:23.0
Qualification of electronic hardware from a corrosion resistance standpoint has traditionally relied on stressing the hardware in a variety of environments. Before the development of tests based on mixed flowing gas (MFG), hardware was typically exposed to temperature-humidity cycling. In the pre-1980s era, component feature sizes were relatively large. Corrosion, while it did occur, did not in general degrade reliability. There were rare instances of the data center environments releasing corrosive gases and corroding hardware. One that got a lot of publicity was the corrosion by sulfur-bearing gases given off by data center carpeting. More often, corrosion was due to corrosive flux residues left on as-manufactured printed circuit boards (PCBs) that led to ion migration induced electrical shorting. Ion migration induced failures also occurred inside the PCBs due to poor laminate quality and moisture trapped in the laminate layers.
Technical Library | 2017-07-27 16:51:57.0
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components.
Precision Cleaning Medium For Manual Flux Removal VIGON® EFM is a precision cleaning agent designed to remove flux residues from electronic assemblies in manual applications. VIGON® EFM is a mixture of halogen-free, organic solvents. It dries fast a
ALPHA® Telecore XL-825 lead-free cored solder wire minimizes spattering in hand soldering operations, thus reducing circuit board contamination and enhancing worker safety and comfort.
Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,
How to Minimize Humidity Interaction with PCBAs for Robustness
Events Calendar | Wed Aug 19 00:00:00 EDT 2020 - Wed Aug 19 00:00:00 EDT 2020 | ,
DfR - Design for Rinse-Ability: Effect of SMT Component Package Design on Cleaning Effectiveness
SMTnet Express, July 16, 2015, Subscribers: 23,036, Members: Companies: 14,463, Users: 38,550 Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber iNEMI (International Electronics Manufacturing Initiative) Qualification
The Surface Finish Effect on the Creep Corrosion in PCB SMTnet Express May 10, 2012, Subscribers: 25098, Members: Companies: 8865, Users: 33085 The Surface Finish Effect on the Creep Corrosion in PCB First published in the 2012 IPC APEX EXPO
| https://www.smtfactory.com/PCBA-Cleaning-Machine-PCB-Defluxing-For-Best-Coating-and-Bonding-Effect-id43566387.html
. Prevent component and PCB corrosion Flux residues left on electronic circuit boards are acidic. If they are not removed through a cleaning process, the residue can absorb ambient moisture from the air and cause corrosion of component leads and PCB contacts
40731 | https://www.smta.org/harsh/Harsh-Environments-Program-2019.pdf?v=20052905555
Surface Mount Technology Association (SMTA)
