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Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications
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Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef
The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E
Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller
We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page HASL WHAT A HASSLE, or HASL'd AGAINby Earl Moon INTRODUCTION This article updates one I wrote for Printed
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
. Common types of surface finishes are: HASL (Hot Air Solder Leveling): A cost-effective finish that enhances solderability and protects copper. ENIG
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. However, the high tensile strength of AuSn20, not to mention its cost, limits its use to smaller die only. The high conductivity of metal is due to the majority contribution of electronic phonons rather than lattice vibrations
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