PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi
Electronics Forum | Mon Jun 04 10:13:48 EDT 2007 | patrickbruneel
Chris, This is probably one of the reasons medical equipment and implants are exempt from the directive. Below a quote from an article published by the medical device network. RoHS excludes medical devices (category 8) and monitoring and control i
Electronics Forum | Thu Oct 26 08:59:57 EDT 2000 | ptvianc
Performing a wetting balance test would be very difficult. The flux cored wire "configuration" is just not compatible with the methodology of the wetting balance test. If the wetting balance is a must, then you might ask the vendor for the flux for
Industry News | 2018-05-22 12:19:27.0
IPC – Association Connecting Electronics Industries® would like to announce the release of additional test coupons for the IPC-2221B Gerber Coupon Generator, an exclusive annual subscription service for IPC member companies. The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons addressing blind, buried, stacked and staggered via structures. The most commonly used coupons for product acceptance are “AB,” “AB/R” and “D” which were introduced in 2016.
Industry News | 2020-01-20 16:42:42.0
The IPC APEX EXPO 2020 best technical conference papers in the domestic and international categories have been selected; the paper authors will receive their awards during the opening keynote session on Tuesday, February 4, 2020.
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/class-3-design-specs_topic331.html
? It would really help to have all the requirements in an easy to read chart or list. Thanks in advance! Bryan Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
: contact angle of Sn wetting on Cu; H: solder bump height; D: bump diameter dimension, as well as flux agent wetting force. In this study, our focus is mainly on oxide removal agent wetting
