Industry Directory | Consultant / Service Provider / Manufacturer / Standards Setting / Certification
Creative Electron is the largest US manufacturer of x-ray inspection systems for electronics. We proudly design and manufacture the award winning TruView X-Ray family of products.
New Equipment | Tape and Reel Equipment
QYSMT MOREL Automatic SMT Splicing Machine BMM08EC What a SMT splicing machine do? The purpose of the automatic material splicing machine machine is to improve the accuracy and efficiency of component reel splicing, and it also has the function of
New Equipment | Tape and Reel Equipment
Automatic SMT Splicing Machine BMM3272W Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prevent e
Electronics Forum | Mon Feb 26 11:10:59 EST 2024 | clpassoni
When the pick&place is at speeds above 80%, the X driver displays error 21, at lower speeds (
Electronics Forum | Tue Feb 27 00:31:36 EST 2024 | erikfriesen
What do you mean by driver? Maybe it's a weak encoder.
Used SMT Equipment | Pick and Place/Feeders
CP45FV NEO Popular CP45FV NEO. Highly Flexible, user friendly machine and highly reliable. Full vision with 6 placement heads, each with individual illumination allowing 6 totally different components to be aligned on the fly. Upward looking
Used SMT Equipment | Pick and Place/Feeders
Samsung CP45-NEO Pick n Place Model: CP45-NEO Vintage: 2007 SMT Placement Machine Windows interface 6 head Nozzles included Manuals included (digital) Feeders included : (20) 8mm (3)
Industry News | 2012-02-15 19:18:44.0
GPD Global announces that its PCD4H Dispense Pump yields excellent results with phosphor and non-phosphor-filled LED encapsulation as viewed on the color chart by tightly grouped results.
Industry News | 2003-07-08 09:22:20.0
A new range of coding profiles for Combicon wire-to-board connectors aims to avoid the pitfalls of inserting the wrong plug into a header when making plug-in connections to a PCB.
Parts & Supplies | Pick and Place/Feeders
Feature : SAMSUNG SMD SMT Spare Part. Part Name: Non-stop PB Type Mechanical Feeder. Rating:8x4mm For Samsung Techwin CP20 CP22 CP30 CP33 CP40 CP40CV CP40LV CP45 CP45F CP45FV CP45NEO CP50 CP60 Surface Mount Technology Equipment Brand : SAMSUN
Parts & Supplies | Pick and Place/Feeders
Samsung Feature : SAMSUNG SMD SMT Spare Part. Part Name: Non-stop PB Type Mechanical Feeder. Rating:8x4mm For Samsung Techwin CP20 CP22 CP30 CP33 CP40 CP40CV CP40LV CP45 CP45F CP45FV CP45NEO CP50 CP60 Surface Mount Technology Equipment Br
Technical Library | 2023-11-20 18:10:20.0
The electronics production is prone to a multitude of possible failures along the production process. Therefore, the manufacturing process of surface-mounted electronics devices (SMD) includes visual quality inspection processes for defect detection. The detection of certain error patterns like solder voids and head in pillow defects require radioscopic inspection. These high-end inspection machines, like the X-ray inspection, rely on static checking routines, programmed manually by the expert user of the machine, to verify the quality. The utilization of the implicit knowledge of domain expert(s), based on soldering guidelines, allows the evaluation of the quality. The distinctive dependence on the individual qualification significantly influences false call rates of the inbuilt computer vision routines. In this contribution, we present a novel framework for the automatic solder joint classification based on Convolutional Neural Networks (CNN), flexibly reclassifying insufficient X-ray inspection results. We utilize existing deep learning network architectures for a region of interest detection on 2D grayscale images. The comparison with product-related meta-data ensures the presence of relevant areas and results in a subsequent classification based on a CNN. Subsequent data augmentation ensures sufficient input features. The results indicate a significant reduction of the false call rate compared to commercial X-ray machines, combined with reduced product-related optimization iterations.
Technical Library | 2020-07-08 20:05:59.0
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second (Gbps) to several hundred Gbps. While manufacturing tests such as Automatic Optical Inspection (AOI) and In-Circuit Test (ICT) are useful in identifying catastrophic defects, most high-speed signals require more scrutiny for failure modes that arise due to high-speed conditions, such as jitter. Functional ATE is seldom fast enough to measure high-speed signals and interpret results automatically. Additionally, to measure these adverse effects it is necessary to have the tester connections very close to the unit under test (UUT) as lead wires connecting the instruments can distort the signal. The solution we describe here involves the use of a field programmable gate array (FPGA) to implement the test instrument called a synthetic instrument (SI). SIs can be designed using VHDL or Verilog descriptions and "synthesized" into an FPGA. A variety of general-purpose instruments, such as signal generators, voltmeters, waveform analyzers can thus be synthesized, but the FPGA approach need not be limited to instruments with traditional instrument equivalents. Rather, more complex and peculiar test functions that pertain to high-speed I/O applications, such as bit error rate tests, SerDes tests, even USB 3.0 (running at 5 Gbps) protocol tests can be programmed and synthesized within an FPGA. By using specific-purpose test mechanisms for high-speed I/O the test engineer can reduce test development time. The synthetic instruments as well as the tests themselves can find applications in several UUTs. In some cases, the same test can be reused without any alteration. For example, a USB 3.0 bus is ubiquitous, and a test aimed at fault detection and diagnoses can be used as part of the test of any UUT that uses this bus. Additionally, parts of the test set may be reused for testing another high-speed I/O. It is reasonable to utilize some of the test routines used in a USB 3.0 test, in the development of a USB 3.1 (running at 10 Gbps), even if the latter has substantial differences in protocol. Many of the SI developed for one protocol can be reused as is, while other SIs may need to undergo modifications before reuse. The modifications will likely take less time and effort than starting from scratch. This paper illustrates an example of high-speed I/O testing, generalizes failure modes that are likely to occur in high-speed I/O, and offers a strategy for testing them with SIs within FPGAs. This strategy offers several advantages besides reusability, including tester proximity to the UUT, test modularization, standardization approaching an ATE-agnostic test development process, overcoming physical limitations of general-purpose test instruments, and utilization of specific-purpose test instruments. Additionally, test instrument obsolescence can be overcome by upgrading to ever-faster and larger FPGAs without losing any previously developed design effort. With SIs and tests scalable and upward compatible, the test engineer need not start test development for high-speed I/O from scratch, which will substantially reduce time and effort.
ML-1200 Two-table off-line PCB Router Features ●High speed CCD visual alignment device. ●Using order mode to realize automatic cutting.Cutting procedure is combined with production model and quantity and produced according to PMC plan. . ●Using AO
Broader scope, the latest ultra-small SMD components (01005) count, the series is as follows: These are the components package specifications. Functions: 1, Empty chip detection capabilities SMD chip counter, the job is simple, positive and neg
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
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Today’s High Accuracy assembly of Flip Chip correlates to assembly rates <5k cph and Lower Accuracy less complex assembly of Die at assembly rates >8k cph
Lewis & Clark | https://www.lewis-clark.com/product/samsung-sm320-pick-and-place/
: Single Gantry 6 Spindle Head Min component size 0402 Max PCB size 18” x 18” Six Laser Flying Vision and Stage Vision systems One Upward Looking Fixed Camera Vision System for IC Placement rates
