Electronics Forum | Mon Feb 12 10:06:46 EST 2007 | CK the Flip Guy
DaveF, Please define a "Cp/Cpk capable profiler." Do you mean one that has software that automatically calculates this for you? I do this at my company, and we track 2 critical variables - Time Above Liquidous and Peak Temps. and this is done on a
Electronics Forum | Mon Dec 06 14:59:37 EST 1999 | Brian W.
Cpk is sometimes referred to as the voice of the process because it is measuring how tight your process is in relation to the specification limits. A Cpk of 1 means that you are running a 3 sigma process (plus or minus 3 sigma). This means that you
Used SMT Equipment | Pick and Place/Feeders
FUJI-NXT III NXT III Scalable Placement Platforms The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips
Used SMT Equipment | Pick and Place/Feeders
FUJI-NXT III NXT III Scalable Placement Platforms The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips
Industry News | 2013-05-13 01:37:26.0
Fuji Machine Mfg. Co., Ltd. is excited to announce the upcoming release of its newly developed NXT III mounting platform. The latest edition to the NXT series offers improved performance in all areas and continues the evolution of a machine which has now sold more than 40,000 modules all over the world, covering every imaginable production type and volume.
Industry News | 2011-06-13 18:06:01.0
Practical Components announces that the new Practical Components TMV® (Through Mold Via) 14 mm Board Drop Test Lead-Free Kit is now available. The kit is designed for the 14 mm Amkor TMV® component.
Parts & Supplies | Pick and Place/Feeders
Brand: FUJI Name: FUJI Scalble Placement Platform NXT Iii Module Width: 320mm Placing Accuracy: +/-0.038 (+/-0.050) Mm (3σ) Cpk≥1.00* Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Part Size: 04
Parts & Supplies | Pick and Place/Feeders
1. Special feature 1.1 Improved productivity:A faster XY robot and faster tape feeders, as well as a newly developed "flying vision" parts camera,mean increased placing ability for all part sizes and types. The new H24G high-speed head achieves 37
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control
AOI - Omron RNS_ptH, RNS-LS, VT-WIN2 VI3000 Marantz 22X IPC 610D certified ISO 9001-2008, etc automotive standards ROHS
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate the defect rate of the measured machine. For example, Cpk = 1
Heller 公司 | http://hellerindustries.com.cn/pdfs/Reflow-Oven-Heller-MarkIII.pdf
— constantly bringing new innovations to market faster and with greater impact than our competitors.Process Control Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all
| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print
. Currently, a variety of alternatives are developed that generally have a melting point temperature of about 40 Tun higher than that of tin-lead alloys, which means that reflow soldering must be at a higher temperature
