Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Electronics Forum | Tue Jul 26 08:57:23 EDT 2011 | indyc
I am trying to rework FP4531 underfill. Some of the underfill flowed to adjacent capacitor and resistor. Even though the datasheet says that it is non-reworkable, has anyone tried reworking / removing excess underfill? Any information would be help
Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef
Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w
Used SMT Equipment | Board Cleaners
Automatic Wash + Rinse + Cleanliness Test + Dry + SPC Lead Free Ready The SMT Series Cleaning Systems include the industry's most powerful batch-format drying system. The SMT series cleaners utilize a combination of convection and radiant heat t
Used SMT Equipment | In-Circuit Testers
Agilent N9020A Standards evolve, product cycles get shorter, and each project demands tradeoffs and decisions about specs and capabilities, about throughput and yield. A highly flexible signal analyzer helps you make solid choices and keep things
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2024-03-11 15:00:03.0
Connect with our experts and see plasma and dispensing equipment for microelectronics manufacturing in booth 3645
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Parts & Supplies | Pick and Place/Feeders
SM24MM feeder Large reel pulley J7265142A J7265173A J7066253 Other Samsung parts are available: J44011011A SM411F_POWER_SUPPLY_STW400-S STW400-S J3153050A Y-AXIS SERVO MOTOR DRIVER[QS1A05AA0MD01S J3153055A SERVO MOTOR DRIVER(100W)[MADDT1205] J70
Parts & Supplies | Pick and Place/Feeders
Samsung CP45 multi cylinder J6701033B CD05-000030 MOTHERBOARD,CPU-NuPRO-E340;SBC,Q67 EP07-000205 J31051003A CPU Cooler EP12-000030A MTSMUP-HD022A-FOLDING_MIRROR FC09-001517A MIRROR_PLATE FC09-001518A MIRROR_CLAMP_1 FC09-001519A MIRROR_CLAMP_2
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Flux spray coating on a PCB with uniformal thickness down to 5 microns, with clear edge definition and minimal overspray. Can coat large or shoot dots with the same jet.
Career Center | Toronto, Ontario Canada | Production,Quality Control,Technical Support
HIGHLIGHTS OF QUALIFICATIONS • Over 5 years of experience working as a Technical Support person, Onsite Technician in maintenance and operation of business environment to support business such as inventory of equipments and supplies as well as softw
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
GPD Global | https://www.gpd-global.com/pdf/doc/CPU-Board-Upgrade-Procedure-22240102.pdf
2 CPU Board Upgrade Procedure 1 - Replace CPU board 5. After completely disconnecting the existing CPU board (PN 2025-0064), remove it from the computer
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
. Flux helps to remove oxides from the metals being solder, improving the overall wettability of solder needed for high quality solder joints
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