New SMT Equipment: crack 20solder interface (66)

Top Cutting PCB Router PCB Depanelizer Machine

Top Cutting PCB Router PCB Depanelizer Machine

New Equipment | Depaneling

Stand Alone Ionizer PCB Depaneling Router Twin Tables and Top Cutting PCB Router Features: • Floor type double table cutting machine, with a speed of 100 mm / s and a positioning speed of 800 mm / s. • High quality shaft system enables the sys

Winsmart Electronic Co.,Ltd

SMT Offline X-ray X-7200

SMT Offline X-ray X-7200

New Equipment | Test Equipment

www.smt11.com www.smtfactory.com Full SMT Factory Solution Partner SMT Offline X-ray X-7200 Introduce: I.C.T X-7200 inspection machine has a wide range of applications. It is commonly used in the internal structure testing of electronic component

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Used SMT Equipment: crack 20solder interface (1)

Universal Instruments (3) GSM1, DEK 265GS, BTU VIP70

Universal Instruments (3) GSM1, DEK 265GS, BTU VIP70

Used SMT Equipment | Turnkey Lines

Functional Pre-Owned Complete SMT Assembly Line - Still Operational    (Subject to prior sell, I am listing this on other venues)   Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe

CybrSecurity Corporation

Industry News: crack 20solder interface (29)

SMT AOI Machine: Revolutionizing SMT Inspection with AI Technology

Industry News | 2024-04-29 03:28:04.0

In the dynamic world of Surface Mount Technology (SMT), precision and efficiency are paramount. Manufacturers worldwide seek inspection solutions that enhance accuracy and streamline production processes. Enter SMT AOI AI Inspection Technology – an innovative solution that combines cutting-edge artificial intelligence algorithms with advanced inspection capabilities.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Best Technical Papers at IPC APEX EXPO 2023 Selected

Industry News | 2023-01-16 07:35:11.0

The best technical conference papers of IPC APEX EXPO 2023 have been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 24.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: crack 20solder interface (1)

Technical Library: crack 20solder interface (2)

Pb-Free Reflow, PCB Degradation, and the Influence of Moisture Absorption

Technical Library | 2024-09-02 17:31:09.0

The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure, such as reflow and rework, have always been a concern for the electronics industry. However, with the increasing spread of Pb-free assembly into industries with lower volume and higher complexity, the occurrence of these events is increasing in frequency. Several telecom and enterprise original equipment manufacturers (OEMs) have reported that the robustness of their PCBs is their number one concern during the transition from SnPb to Pb-free product. Cracking and delamination within PCBs can be cohesive or adhesive in nature and can occur within the weave, along the weave, or at the copper/epoxy interface (see Figure 1). The particular role of moisture absorption and other PCB material properties, such as out of plane expansion on this phenomenon is still being debated.

DfR Solutions (acquired by ANSYS Inc)

Controlling Moisture in Printed Circuit Boards

Technical Library | 2019-05-01 23:18:27.0

Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.

CALCE Center for Advanced Life Cycle Engineering

Videos: crack 20solder interface (4)

Laser PCB Depaneling Machine

Laser PCB Depaneling Machine

Videos

Features: 1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries; 2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous securit

ChuangWei Electronic Equipment Manufactory Ltd.

DESKTOP PCB ROUTER YSATM 4C

DESKTOP PCB ROUTER YSATM 4C

Videos

Features: 1. Desktop single table router speed 500mm / s. 2. High-quality shaft system allows the system to quickly increase and decrease, reduce the same period of time, improve productivity, while maintaining high accuracy. 3. Use high-quality ha

YUSH Electronic Technology Co.,Ltd

Express Newsletter: crack 20solder interface (1207)

SMTnet Express - September 18, 2025

SMTnet Express, September 18, 2025, Subscribers: 26,345, Companies: 12,438, Users: 29,785 █  Electronics Manufacturing Technical Articles Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step

Partner Websites: crack 20solder interface (120)


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