Industry Directory | Manufacturer
Suppliers of solder pastes, wave soldering liquid fluxes and SMT adhesives and cored solder wires for all soldering requirements.
Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
New Equipment | Solder Materials
A rich and line-up of solders possessed of various characteristics and properties. NSH63V forms a strong join and displays excellent resistance to heat cycle stress, thus prolonging the working life of various electrical devices. This solder has
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
Used SMT Equipment | SMT Equipment
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
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Used SMT Equipment | Soldering - Reflow
Features 1. Full hot air reflow heat fast, high thermal efficiency compensation, delta t less than ± 2 ℃ soldering is uniform. 2. HELLER company has 40 years of history, process maturity. 3. maintenance costs low, the furnace normal use, electrici
Industry News | 2015-06-11 16:02:18.0
MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.
Industry News | 2017-04-24 19:04:48.0
This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.
Parts & Supplies | Soldering - Wave
Controller and interface assembly from an ERSA wave solder machine EPROM V2.97 KUHNKE 71.633. 425.120.01 The glass is cracked but the LCD is not cracked. FOB: Origin AssuredTechnicalServiceLLC@Gmail.com
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/132.html PCB cutting machine/guillotine separator/PCB depaneling machine/PCB panel separator ASCEN specializing the SMT assmebly line equipment manufacture the more detail please ch
http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/132.html PCB cutting machine/guillotine separator/PCB depaneling machine/PCB panel separator ASCEN specializing the SMT assmebly line equipment manufacture the more detail please ch
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. The pressure caused by the steam can crack the components with some cracks being so severe they propagate to the exterior. Preheat The process of stabilizing the work to be soldered at a temperature below the solder melting point
| https://pcbasupplies.com/alloy-solder-paste-enig/
. That helps to prevent propagation of crack at the solder joint in thermal cycling. As found below, SB6NX shows much higher sheer strength than SAC305 with ENIG and OSP substrate alike
