Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe
Electronics Forum | Fri Jul 12 22:15:56 EDT 2013 | ericrr
Sorry to build up your hopes. The latest thing to hit the air ways at work, I was accessed of fiddling with the oven settings, because there were reports of "cracked joints" there was no mention of where the cracks were, cracked at the pcb or cracke
Electronics Forum | Mon Jul 15 08:11:04 EDT 2013 | emeto
I am pretty sure that is a moisture issue. You should probably bake your boards and some of your parts.
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
http://www.pcb-separator.com/ https://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2019/1113/832.html Hand push pcb cutter/PCB cutting machine manufacturer/PCB V-cut machine manufacturer/PCB depaneling equipment, automatic pcb cutting machine,
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock
SMTnet Express, February 6, 2020, Subscribers: 33,800, Companies: 10,971, Users: 25,576 Accurately Capturing System-Level Failure of Solder Joints Credits: DfR Solutions Consortium Projects - Thermal Cycling Reliability Consortium projects allow
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/automated-optical-inspection-systems?con=t&page=26
. Nordson YESTECH AOI inline and offline/benchtop systems offer high-speed PCB inspection with exceptional defect coverage. Inspecting solder joints and verifying correct part assembly quickly and accurately enables users to improve quality on the fly and increase throughput