New Equipment | Soldering Robots
High Technical Rotary Table Type Pulse Heating Hot Bar Soldering Machine Specifications Microprocessor based controller provides precise and consistent temperature control. Details: Microprocessor based controller provides precise and consi
Fill in the RFQ at our website for Fast Free Quotation: https://allwin21.com/rfq-upgrade-kits/ Or email us at sales@allwin21.com for more info. The Upgrade Kits include an advanced Allwin21 AW System Control with touch screen Graphic User Interface
Electronics Forum | Mon Jun 27 08:18:47 EDT 2022 | kelvinchoong
Hi All, Appreciate any inputs that may be given. Currently i am operating VP6000 Vapour Phase Reflow Oven from ASSCON. Over the last 2 years, we have around 100 different Recipes for many different PCBs. Each recipe is adjusted(6 Different Paramete
Electronics Forum | Thu Jun 26 18:53:43 EDT 2003 | rlwilliams
I'd like to poll the audience: When it comes to creating/naming files for your oven recipes, do you select from a given set of recipes (E.g., 10 recipes used for all assemblies), or do you, create a 1-for-1 relationship where you have a recipe for e
Industry News | 2012-01-10 19:58:20.0
KIC announces the release of the Reflow Process Index (RPI), designed to help electronics manufacturers receive maximum quality and throughput from their reflow ovens.
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
Beyond the hype, what hat does 'smart' technology do for the customer? Bjorn Dahle, CEO at KIC joins SCOOP's Philip Stoten to explore how value can be delivered and the importance of deep domain expertise to optimize processes and inform production b
Career Center | Phoenix, Arizona USA | Production,Quality Control
Growing contract electronic manufacturer seeking to fill multiple positions: SMT Operator/Programmer Individual will determine and specify, revise and/or review, the most economic methods, operation sequence and tooling for the fabrication of pri
Career Center | Moline, USA | Management,Production,Technical Support
Numerous years experience developing complete manufacturing processes for electronic assemblies.
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling The oven recipe, which consists
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Embedded-IR-Heater-User-Guide-22140091.pdf
User Guide Basic operations 7. To finish creating the new recipe: a. Reopen the Recipe Manager by touching the RECIPES button. b. Select your newly saved recipe from the drop down menu. c. Edit and save parameter values, as needed, per Change recipe heat
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
) excessive pad size vs. the part’s terminal size, leading to the same effect. Te m p er at ur e (° C ) Preheat Preflow Reflow Cooldown Dwell at Liquidus 20 to 70 sec Dwell at Liquidus 20 to 60 sec 230 230 220 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 2 to 3 min 3.5 to 4 min 200° to 210°C b. a. Figure 1. The “standard” reflow profile (a
