Industry Directory | Manufacturer
Manufacturer of UTM, Impact tester, Dynamic Testing System, Creep & Rupture Testing Machine, Compression Tester, Bending Tester, Torsion Tester, Friction Tester, Cupping Tester etc.
Industry Directory | Manufacturer
Jinan Scientific Test Technology Co., Ltd. is a high technology manufacturer and designer devoting on researching and developing, sales and service of material testing instrument in Jinan city, China.
New Equipment | Surface Finish
Increase Yields. Improve Quality. Reduce Rework and Rejects. Enthone provides the world’s most applied and preferred PCB final finishes. Offering the widest selection and deepest knowledge of lead-free compatible finishes, we work with leading OEMs,
Paragon Innovations, Inc. is a leading provider of design services having experience in designing embedded systems in several industries including medical, Internet, telecommunications, automotive, military, retail electronics and PDAs. Paragon desi
Electronics Forum | Thu Sep 17 23:36:35 EDT 2009 | Sean
All, We know that incomplete immersion silver could potentially lead this creeping corrosion. Is there any way to check bare PCB for incomplete immersion silver coverage, especially on the via hole area? Thanks, Sean.
Electronics Forum | Thu Sep 03 12:03:52 EDT 2009 | Sean
Hi All, I have few questions about creeping corrosion that potentially happen on lead free immersion silver PCB as below: 1) What test that we can conducted to verify whether the failure we seen is due to creeping corrosion? 2) I heard that lead fr
Industry News | 2018-04-09 19:51:33.0
SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2012-11-02 09:04:14.0
IPC and SMTA jointly announce the agenda for Session 5 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Technical Library | 2021-04-08 00:36:50.0
Understand the sensitivities of the identified factors to Creep Corrosion. Correlate experimental test conditions to environment classification standards.
Technical Library | 2022-03-16 19:41:17.0
Creep corrosion occurs in electronics assemblies and it is reminiscent to electromigration but does not require electrical field to drive the reaction. Corrosive elements and moisture must be present for creep corrosion to occur. Sulfur is the most prominent element to cause creep corrosion in environments such as paper mills, rubber manufacturing, mining, cement manufacturing, waste water treatment etc., also including companies and locations nearby such industries. The main part of printed circuit board assembly (PCBA) to be affected is the PCB surface finish. Especially immersion silver is prone to creep corrosion, but it sometimes occurs in NiPd (lead frames), and to a lesser extent in ENIG and OSP surface finishes. As the use of immersion silver is increasing as PCB surface finish and electronics are more and more used in harsh environments, creep corrosion is a growing risk. In this paper we will present the driving forces and mechanisms as well as suitable tests and mitigation strategies against creep corrosion
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
SMTnet Express, May 10, 2018, Subscribers: 31,023, Companies: 10,930, Users: 24,698 Relative Humidity Dependence of Creep Corrosion on Organic-Acid Flux Soldered Printed Circuit Boards Haley Fu, iNEMI Creep corrosion on printed circuit boards
The Surface Finish Effect on the Creep Corrosion in PCB SMTnet Express May 10, 2012, Subscribers: 25098, Members: Companies: 8865, Users: 33085 The Surface Finish Effect on the Creep Corrosion in PCB First published in the 2012 IPC APEX EXPO
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5052
. In our previous work, the creep properties of Violet (Sn- 2.25Ag-0.5Cu-6.0Bi) and SAC 305 were evaluated both before and after the application of an above-solvus thermal treatment
| http://etasmt.com/cc?ID=te_news_bulletin,13161&url=_print
. Once fatigue or creep cracking begins to occur in use, the fracture speed is also faster. The bad shape of reflow solder joints will also cause the phenomenon of weight reduction and light weight reduction, shortening the life of solder joints. 4
