Industry Directory | Consultant / Service Provider
Elmet LLC is an accredited lab, primarily providing cross sectioning of circuit boards, visual and x-ray inspections of PCBAs and other metallographic and metallurgical services including SEM examination and EDS analysis.
Non-profit trade association for the health care industry comprised of a broad cross-section of approximately 200 organizations. Medical Alley is known for its high-quality health care education and training programs, government issue leadership, and convening its members to address critical health care issues.
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
A resistor is a two-terminal electronic component made of resistive material with a certain structural form that can limit the flow of current in a circuit. The resistance value of a resistance element is generally dependent on temperature, material,
Used SMT Equipment | General Purpose Test & Measurement
The Fluke 5500A Multi-Product Calibrator is a revolutionary product that addresses a wide cross-section of your electrical calibration work load. It sources direct voltage and current, alternating voltage and current with multiple waveforms and harmo
Used SMT Equipment | In-Circuit Testers
Fluke 5500A Multi-Product Calibrator The Fluke 5500A Multi-Product Calibrator is a revolutionary product that addresses a wide cross-section of your electrical calibration work load. It sources direct voltage and current, alternating voltage a
Industry News | 2003-05-23 08:24:49.0
Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.
Industry News | 2003-05-16 08:23:59.0
A novel PCB socket block features integrated crossconnections, which facilitate daisychaining of supply voltage and signal lines in multiboard applications, saving installation time and money.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2021-09-21 20:20:22.0
The electronics industry has been using the epoxy puck for the processing of the vast majority of electronics microsections since the 1970s. Minimal advancements have been seen in the methods used for precision micro-sections of PCBs, PCBAs, and device packages. This paper will discuss different techniques and approaches in performing precision and analytical micro-sections, which fuse the techniques and materials common in preparation of silicon wafers and bulk materials. These techniques have not only been found to produce excellent optical results, but transfer effectively to SEM for high magnification inspection and further analysis with minimal post-lapping preparation needed. Additionally, processing time is reduced primarily due to a significant reduction of bulk material removal earlier in the preparation, therefore needing less removal at later lapping steps compared to traditional sectioning methods. Additional techniques are introduced that mitigate some classic challenges experienced by technicians over the decades.
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
We stopped by ifixit for a chat about our new TruView Fusion CT - our 3D X-Ray system. And of course, we did a virtual teardown of the Apple AirPod, because we just can't help ourselves...
Events Calendar | Mon Jul 17 18:30:00 UTC 2023 - Mon Jul 17 18:30:00 UTC 2023 | Chippewa Falls, Wisconsin USA
UMW Chapter In-Person Event: PCB 101 Workshop and Tour at TTM Chippewa Falls
Events Calendar | Wed May 12 18:30:00 UTC 2021 - Wed May 12 18:30:00 UTC 2021 | ,
Joint Chapter Meeting: Photonic Soldering
Career Center | Austin, Texas USA | Engineering
KN Research is assisting it's award-winning high-tech client to fill a Staff Reliability Engineer position. We are seeking an experienced Reliability Engineer with strong skills in hands-on product failure analysis, field failure and internal failur
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Shanghai, China | Engineering,Research and Development,Technical Support
Lead the operation and activity of UIC SMT Lab in China site. Operations include the following: 1. Prototyping of electronic and semiconductor packaging �� Flip chip prototyping, Pin-in-Paste prototyping, Pb-free process assembly 2. Failure analysis
Career Center | Denton, TX-Texas USA | 2017-05-06 20:13:59.0
Engineering,Production,Quality Control
SMTnet Express, September 23, 2021, Subscribers: 26,674, Companies: 11,444, Users: 26,860 Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize
| https://www.eptac.com/faqs/ask-helena-leo/ask/air-bubbles-or-voids-in-solder-joints
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint? Question
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
) metallographic cross-sectioning thru package/solder joint interface showed a high incidence of voiding not observed in orthogonal cross-section
