Industry Directory | Training Provider / Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
CEM with SMT,thruhole, BGA,CSP,test ,rework, part recovery and reballing capabilities. Medium volumes turnkey or consigned materials. Also quick turn prototypes.
YAMAHA YV88 Full Automatic High Speed Chip Mounter Board size MAX.460 x 335 MIN.50 x 50 mm PCB Thickness 0.4 ~ 3.0mm Conveyor Transfer Right→ Left(Left→ Right:Option)
Refurbished YAMAHA YV100xg Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute
Used SMT Equipment | Chipshooters / Chip Mounters
Product name: YV100XG YAMAHA multi-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XG High speed and high precision multi-function modular placement machine 0.18 seconds/CHIP ul
Used SMT Equipment | SMT Equipment
Product name: YV100XG YAMAHA multi-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHA YV100XG High speed and high precision multi-function modular placement machine 0.18 seconds/CHIP ul
Industry News | 2003-06-25 12:49:17.0
Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies
Industry News | 2013-09-03 11:52:21.0
BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Dual valves on a single platform. One valve dispenses the dam, a second valve encapsulates the cavity. http://www.nordsonasymtek.com
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Sun May 03 18:30:00 UTC 2020 - Sun May 03 18:30:00 UTC 2020 | ,
Ball Grid Array Rework - How to Do It Successfully
Career Center | , | Engineering
A well respected, cutting edge technology leader in underfill chip scale packaging electronic materials for uses in cell phone, wireless applications and more is in need of a particular combination of experience in process engineering, CSP equipment
Career Center | Boise, Idaho USA | Engineering
In need of a contract engineer ASAP!! This person will help with the fabrication of implantable medical devices. Incumbent must have electronic packaging and uBGA experience. The qualifications are below. This position will be from 3-9 months and nee
Career Center | Minneapolis, Minnesota USA | Engineering,Management,Quality Control,Research and Development
Advanced Process/Manufacturing Engineer with many years of experience at multiple companies. Unique ability to perform and establish root cause. Designer, developer, and implementer of a wide variety of automated assembly systems, special projects,
Career Center | Cochin, Kerala India | Engineering,Management,Production,Technical Support
9 Years Experience in SMT Manufacturing Process, Quality Control Process, Testing and Engineering of Windmill power projects. The experience include: - � Skill in selection and installation of new manufacturing lines. � Conduct and analyze process t
Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
grid array (BGA) and chip scale package (CSP) manufa
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_collapsing-vs-noncollapsing-bga-balls_topic1868.xml
:37amHow does one know if the BGA (CSP) has collapsing or non-collapsing solder balls?
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/model-rw-sv2000a-bga-rework-station
. 1 year part warranty. Lifetime technical support. Suitable for large Servo, Base station, Industrial computer repair, able to rework difficult components like CGA 、 BGA 、 QFN 、 CSP 、 LGA 、 Micro SMD 、 MLF(Micro Lead Frames
