Industry Directory | Other / Consultant / Service Provider / Manufacturer
ScanCAD is an industry leader in inspection, measurement, process control and reverse engineering. Our solutions support OEM's, manufacturers, stencil fabricators, repair depots, and others in optimizing quality and yield.
Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
New Equipment | Rework & Repair Equipment
The BEST PCB pad repair repair kit gives you the tools you need for fast modification and repair of PCB circuit pads-no matter what their size. Our online PCB repair training videos, our master instructors along with these materials allows you to mee
New Equipment | Rework & Repair Equipment
Stainless Steel Brush (SH-60) 2 5/16" Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad and for general cleaning purposes. Available in Standard and Miniature
Used SMT Equipment | Pick and Place/Feeders
Product number: YV100 Ⅱ Products in detail YAMAHA multi-function chip mounter YAMAHA YV100II The brand YAMAHA model YV100 - II Automatic manual automatic SMT speed 10000(grain per hour) Japan's YAMAHA YV100II SMT machine: The patch speed: 0
Used SMT Equipment | Chipshooters / Chip Mounters
Refurbished YV180XG Pick and Place Machine Panel size L Type: Max L380 x W330 mm ∼ Min L50 x W50 mm Panel thick 0.4 ~ 3.0 mm Mounting ±0.05 mm (0.01mm control) Mounting angle ±180° (0.01° control) Mounting speed 0.095 se
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2009-10-17 09:43:47.0
Reduce PCB Repair Costs
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
This video is on the dry film pad repair technique per IPC 7721 standards. BEST professional instructors demonstrate the proper technique for the repair for PCB pads using the dry film. http://www.solder.net More on PCB pad repair here: http://www.s
PCB pad circuit repair using epoxy. Using multiple angles including overhead and from both right and left angles the BEST instructor staff demonstrates plainly how to repair a PCB pad using the epoxy method. This method is per IPC 7721 4.4.1. http://
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Minneapolis, Minnesota USA | Engineering,Management,Quality Control,Research and Development
Advanced Process/Manufacturing Engineer with many years of experience at multiple companies. Unique ability to perform and establish root cause. Designer, developer, and implementer of a wide variety of automated assembly systems, special projects,
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
ORION Industries | http://orionindustries.com/pdfs/gappad.pdf
. * Graphs and data generated from Young's Modulus, calculated using 0.01 inch/min. step rate of strain with a sample size of 0.79 inch2. MODULUS * The modulus of Gap Pad VO is rate dependent due to its viscoelastic properties
| http://etasmt.com:9060/te_product_g/2019-08-27/5029.chtml
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