New Equipment | Assembly Services
High Speed SMT Production Line High Speed PCB Production Line High Speed LED Production Line High Speed SMT Assembly Line High Speed SMT PCB Production Line YAMAHA SMT Assembly line YAMAHA PCB Assembly line YAMAHA SMT production line
New Equipment | Assembly Services
High Speed YAMAHA SMT Production Line YAMAHA SMT Production Line High Speed SMT Production Line High Speed YAMAHA PCB Production Line High Speed YAMAHA LED Production Line YAMAHA SMT Assembly line YAMAHA PCB Assembly line YAMAHA SMT product
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Technical Library | 2013-12-05 17:09:03.0
The functionality of electronic devices continues to increase at an extraordinary rate. Simultaneously consumers are expecting even more and in ever smaller packages. One enabler for shrinking electronics has been the flexible circuit board that allows the circuit board to fit a wide variety of shapes. Flexible printed circuits (FPC) have the capability to be very thin and can have unpackaged components directly attached using surface mount technology (SMT) and flip chip on flex technologies. Bare die can also be thinned and attached very close to the circuit board. However one caveat of high density flexible circuit boards with thin die is that they can be very fragile. The use of back side films and underfill can protect the die making circuits more robust. For underfill to work well it requires good adhesion to the circuit board which can mean that flux residues under the die normally must be removed prior to underfilling.
Technical Library | 2021-08-18 01:27:15.0
The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated circuits (ICs) on/in flexible foils have the potential to deliver high performance electrical functionalities at very low power requirements while being mechanically flexible.
Fraunhofer EMFT Research Institution for Microsystems and Solid State Technologies
In the realm of electronics manufacturing, Automated IC Programming Systems epitomize efficiency. This guide navigates through diverse package types supported by these systems, showcasing their adaptability. From PLCC to BGA, these systems are the co
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
| https://www.eptac.com/class/printed-circuit-engineering-designer/
. This program has been carefully crafted by some of the most recognized industry leaders in the printed circuit engineering/design world and allows attendees to capitalize on their experience and
| http://etasmt.com:9060/te_product_j/2020-03-28/12229.chtml
: High Reliability Nitrogen Reflow Oven Model: Nitrogen Reflow Oven Brief: High reliability reflow soldering oven, reflow soldering machine, nitrogen reflow oven, with high professional SMT solutions to form high speed, flexible production line
