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New Equipment | Rework & Repair Equipment
Semi-automatic BGA Rework Station ZM-R6200 WhatsApp/wechat/Skype：+86 18779975930 Email: sales25@zhuomao.com.cn China Biggest BGA Rework Station Manufacturer Repairing Micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, PCB, All Mobile Phone Board LED ( LED
New Equipment | Rework & Repair Equipment
Application This machine is used for repairing the broken BGA (Ball Grid Array package) chipset on the PCB motherboard. 1. Laptop & desktop PCBA 2.Game console,such as Xbox one,Play Station 4 3.Mobile phone PCBA 4.TV&TV Set-top box motherboard 5.Se
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2022-08-23 03:26:21.0
Today's smart wearable and automotive electronic products are increasingly developing towards small, light, thin, short, and multi-functional Friendly mobile phone assembly and manufacturing new materials, what challenges will PCBA circuit board assembly technology and circuit board testing and testing technology face, and which aspects will it develop towards, ICT testing, flying probe tester, AOI testing, X-Ray inspection, 3D-CT inspection, etc., has become one of the important hot topics discussed in the electronics manufacturing industry.
In this video, you will know the bga rework machine how to hot air. After watched it, please give Joy Rong a " like", thank you for your support. Product Application 1.Desolder and solder all the BGA Chip, remove and repair different motherboard BGA
| https://www.eptac.com/news/eptac-corporation-introduces-new-interactive-hands-on-pcb-inspection-program/
Interviewer Joins EPTAC Corporation EPTAC Corporation Releases Update to Popular IPC Certification Mobile App San Diego PCB’s Michael Creeden Joins EPTAC Corporation on IPC Designer Certification Collaboration EPTAC Corporation Continues Expansion with Chicago Acquisition and Additional IPC Licenses Search Looking for Training Products? SolderTraining.com can help
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
-Free Soldering/Reliability Low Temperature Processing Low Volume/Prototype Non-Wet Open (NWO) Defects Package-on-Package Assembly Part Obsolescence Placement Printing Reflow Soldering/ Wave Soldering Rework and Repair of QFNs
