New Equipment | Solder Materials
Superior Drop Shock Performance AND Thermal Cycling Reliability Current Industry Dilemma The standard set of Pb-free alloys has a dramatic trade-off between thermal cycling and drop testing. Additionally, all these SAC alloys are far inferior to
FOXBORO 11GM-CS1 PRESSURE XMTR FOXBORO 1210-03-D PHASE DET/AMP FOXBORO 130M-N2 PNEUMATIC CTRL FOXBORO 130M-N4 PNEUMATIC CTRL FOXBORO 130M-N5 PNEUMATIC CTRL FOXBORO 13A TRANSMITTER FOXBORO 13A1-MKS TRANSMITTER FOXBORO 13AH-S2 TRANSMITTER FOXBO
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
SMTnet Express, April 28, 2022, Subscribers: 25,631, Companies: 11,565, Users: 27,194 The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys The different rates of thermal expansion of the many
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6009.html
control unit 03052349-01 Push-in L con. w. push-in sleeve QSL-12H 03052363-01 Adjusting gauge 03052368S01 Patch cable Cat.5e FTP 15m GY 03052386S01 Pneumatikschlauch TS1209 schw.Nylon 1M 03052394-01 SN 62355 - M5x10-10.9, verz. DSP 03052428-01 WASTE SLIDE
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