Industry Directory | Consultant / Service Provider / Manufacturer
Soligie is the leading company to utilize high speed manufacturing to produce printed electronics with a variety of conductive, resistive and proprietary materials on flexible substrates such as PET, paper and foil.
Industry Directory | Manufacturer
Automotive Electronics and Lighting design and manufacturing
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
Electronics Forum | Mon Feb 19 13:04:17 EST 2001 | billschreiber
The ultrasonic frequency used in today�s stencil cleaners is usually a 40 kHz �sweep� frequency (also used on semiconductors and other sensitive cleaning applications). This frequency is not low enough to cause stencil damage (the lower the frequen
Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
Industry News | 2003-02-21 08:53:41.0
Gould Electronics Inc. said that all of its U.S. copper foil manufacturing will be consolidated at the company's Chandler, AZ facility by the end of the third quarter of 2003.
Industry News | 2013-10-15 18:26:54.0
IPC – Association Connecting Electronics Industries® awarded the first IPC J-STD-004 Qualified Products Listing (QPL) certificate to Indium Corporation’s Clinton, N.Y., USA facility.
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Parts & Supplies | SMT Equipment
00375200-01 Retrof.kit Discharge Choke Coil, HS50-60 00375245-01 SPARE PART KIT X-DRIVE FOR HF UNTIL S-NR. 00375273-01 Cable abrasion protection foil 00375274-01 Cable abrasion protection foil 00375276-01 Cable abrasion protection foil 300mm 003
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Parts & Supplies | SMT Equipment
00347863-01 SW CAN-Terminal-Programm 00347980-01 HOLDER RIGHT SIDE S23 CUTTER UNIT 00348121-01 Servicebox SIPLACE S-27 HM. Provided free of charge with initial system installation.Indicated price valid for additional orders. 00348184-01 Stripper r
Technical Library | 2011-12-08 17:46:42.0
The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c
Technical Library | 2020-09-02 22:14:36.0
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The printed circuit board (PCB) must support this trend as the central interconnection of the system. There are several options for fine line circuitry. A typical fine line circuit PCB product using copper foil technology, such as the modified semi-additive process (mSAP), uses a thin base copper layer made by pre-etching. The ultrathin copper foil process (SAP with ultrathin copper foil) is facing a technology limit for the miniaturization due to copper roughness and thickness control. The SAP process using sputtered copper is a solution, but the sputtering process is expensive and has issues with via plating. SAP using electroless copper deposition is another solution, but the process involved is challenged to achieve adequate adhesion and insulation between fine-pitch circuitries. A novel catalyst system--liquid metal ink (LMI)--has been developed that avoids these concerns and promotes a very controlled copper thickness over the substrate, targeting next generation high density interconnect (HDI) to wafer-level packaging substrates and enabling 5-micron level feature sizes. This novel catalyst has a unique feature, high density, and atomic-level deposition. Whereas conventional tin-palladium catalyst systems provide sporadic coverage over the substrate surface, the deposited catalyst covers the entire substrate surface. As a result, the catalyst enables improved uniformity of the copper deposition starting from the initial stage while providing higher adhesion and higher insulation resistance compared to the traditional catalysts used in SAP processes. This article discusses this new catalyst process, which both proposes a typical SAP process using the new catalyst and demonstrates the reliability improvements through a comparison between a new SAP PCB process and a conventional SAP PCB process.
00375200-01 Retrof.kit Discharge Choke Coil, HS50-60 00375245-01 SPARE PART KIT X-DRIVE FOR HF UNTIL S-NR. 00375273-01 Cable abrasion protection foil 00375274-01 Cable abrasion protection foil 00375276-01 Cable abrasion protection foil 300mm 003
00347863-01 SW CAN-Terminal-Programm 00347980-01 HOLDER RIGHT SIDE S23 CUTTER UNIT 00348121-01 Servicebox SIPLACE S-27 HM. Provided free of charge with initial system installation.Indicated price valid for additional orders. 00348184-01 Stripper r
Career Center | Lincoln, Nebraska USA | Engineering
Brief Description of Job Duties: Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and r
Career Center | Lincoln, Nebraska USA | Engineering
Provide new program engineering support with emphasis on technical SMT process development. Key activities would include recommendations and implementation of components, SMT pad design, solder methods, testing and reliability for both rigid and foi
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Evaluation of Stencil Foil Materials, Suppliers and Coatings Evaluation of Stencil Foil Materials, Suppliers and Coatings by: Chrys Shea; Shea Engineering Services , Ray Whittier; Vicor Corporation The past few years have brought PCB assemblers a
