Inline High Precision CCD fiducial Visual Dispensing Machine This is an inline dispensing machine, connecting other machines at the front and in the back via a conveyor, and communication signals (e.g. SMEMA). Working as an automatic assembly line,
Electronics Forum | Wed Feb 20 18:05:24 EST 2008 | slthomas
Tented vias have solved problems for me in the past, but never created any. I have heard seemingly pointless discussions about whether or not the EE that designed the board designed it with filled vias in mind (a consideration of current carrying c
Industry News | 2003-03-06 08:29:50.0
Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably
Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Technical Library | 2009-07-22 18:33:41.0
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV.
Technical Library | 2009-01-01 16:37:38.0
Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect. The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste.
Career Center | Tampa, Florida USA | Engineering,Management,Research and Development,Sales/Marketing,Technical Support
Spartronics is more than just a company. We have great facilities, a dedicated and talented team, tremendous capacity and capabilities, and longstanding customers who need us. Now, it’s all about driving forward with a winning strategy that bui
Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums SMT Equipment Company
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing
Lewis & Clark | https://www.lewis-clark.com/shop/page/4/
– 15.00 1- PS – Voltage 12 – Current 2.50 1- AFTM 1- IEEE 1 – MTG Condition: Complete & Operational Sold! This unit has been sold. Please email us at sales@lewis-clark.com for additional options. Out Of Stock Agilent Technologies SJ50 Automated Optical
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_DataSheet_IPCDesigner_CID-Plus.pdf
• Power and Ground Routing Techniques • Conductor Current Carrying Capacity vs. Temperature Rise • Layout Approaches for Crosstalk Minimization DAY 3 COMPONENT AND ASSEMBLY ISSUES
