Industry Directory | Manufacturer / Manufacturer's Representative
Sales/Marketing, Manufacturers Representatives, Used Equipment Sales
Industry Directory | Manufacturer
Consider the convenience of having all of your electronic assembly needs handled by a single source with a strong commitment to quality and customer satisfaction. Whether your need is for prototypes
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
The AIP is a new Windows NT based Image Processor that surpasses all current industry standards. New functionality includes: * Automatically detects solder balls and voids. * Automatically corrects xray image distortion using dual calibration met
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Mon Sep 22 04:59:10 EDT 2008 | fadzil66
I have concern about cleaning solder ball after misprinting paste on PCB, currently use vigon 200 with ultrasonic generate but only 70% solder ball able to remove, Any other method or equipment can help to clean solder ball.
Used SMT Equipment | Pick and Place/Feeders
JUKI KE-2080 Pick and Place Machine Since entering the electronics industry equipment field in 1987, JUKI has pioneered a new field with its original modular mounters that match the production innovation required by the electronics industry. The comp
Used SMT Equipment | AOI / Automated Optical Inspection
R Front Rail Fixed Application Version: 7.20C (RNS) Ladder Version: 7.100B (RNS) Image Resolution: 15um AC 120V, 2 Phase, 50/60 Hz, 1.5 kVA Max Current: 15A Hardware Configuration: Image Signal Input Unit: - Camera: 3-CCD Camera - Illumi
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Parts & Supplies | Pick and Place/Feeders
101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146
Technical Library | 2015-04-16 16:11:43.0
Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling, fringe projection and confocal microscopy are expensive, require complicated setup and are slow, which makes them difficult to use in a real-time manufacturing setting. Therefore, a reliable, in-line ball height measurement method is needed for inspecting units undergoing assembly. (...) In this paper, an automatic, stereo vision based, in-line ball height inspection method is presented. The proposed method includes an imaging setup together with a computer vision algorithm for reliable, in-line ball height measurement.
Technical Library | 2015-08-13 15:52:40.0
Pad cratering has become more prevalent with the switch to lead free solders and lead free compatible laminates. This mainly is due to the use of higher reflow temperature, stiffer Pb-free solder alloys, and the more brittle Pb-free compatible laminates. However, pad cratering is difficult to detect by monitoring electric resistance since pad cratering initiates before an electrical failure occurs. Several methods have been developed to evaluate laminate materials' resistance to pad cratering. Pad-solder level tests include ball shear, ball pull and pin pull. The detailed methods for ball shear, ball pull, and pin pull testing are documented in an industry standard IPC-9708. Bansal, et al. proposed to use acoustic emission (AE) sensors to detect pad cratering during four-point bend test. Currently there is an industry-working group working on test guidelines for acoustic emission measurement during mechanical testing.
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Killdeer, North Dakota USA | Engineering
SUMMARY OF RESPONSIBILITIES The purpose of this position is to provide guidance and support to the production operations in the area of responsibility and to provide a work environment where coworkers have the tools, training and leadership to build
Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support
CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing
An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Such a clear correlation has not been established between process macro voiding and decreased reliability. Aspandiar points out that the current industry position states that macrovoids do not affect solder joint reliability [3
| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue
. This is data, not anecdotal evidence, so we should pay attention. Voids are truly a phenomenon in liquid physics, where you have two liquids, molten solder and some other non-metallic liquid, such as flux and carrying vehicles
