Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Consultant / Service Provider
We are your obsolete industrial product specialists. Our inventory includes VME, cPCI, ATCA, SBCs and much more industrial electronics
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
New Equipment | Board Handling - Conveyors
product instruction ※ Easy to operate touch screen control interface ※Telescopic structure, width adjustable, easy to walk ※ Photoelectric sensors with protection, more secure ※ Smooth and parallel width adjustment (lead screw) ※SMEMA port is c
Electronics Forum | Sun Apr 07 18:21:08 EDT 2002 | murt
Hi I am a collage student and I was wondering if anyone could explain to me how you would estimate the trough-put, product and cycle time for a double-sided mixed technology pcb assembly. I would be grateful for any information Thanks Martin.
Electronics Forum | Sat Nov 05 02:56:14 EDT 2016 | anhsang38
checking component--> turn off vacuum and blow air to place component on the board.
Used SMT Equipment | Pick and Place/Feeders
2006 Siemens HF/3 SMT Pick & Place Cycles: 21,449,161 Note: The following items are included with this machine: (4) Feeder Carts (3) 12 Segment Placement Heads Serial: A402-12031214 Item Location: Guadalajara, Mexico
Used SMT Equipment | Pick and Place/Feeders
2006 Siemens HF SMT Pick & Place Cycles: 29,971,511 Note: The following items are included with this machine: (3) Feeder Carts (1) MTC 2 (1) 6 Segment Placement Head Serial: A368-12031214 Item Location: Guadalajara, Mexico
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Jun 23 00:00:00 EDT 2020 - Thu Jun 25 00:00:00 EDT 2020 | College Park, Maryland USA
Symposium on Counterfeit Parts and Materials
Events Calendar | Wed Mar 24 00:00:00 EDT 2021 - Wed Mar 24 00:00:00 EDT 2021 | ,
Arizona/Sonora Chapter Meeting: Electronic Component Market Update
Career Center | Providence, Rhode Island USA | Production
Manufacturing Supervisor for an electronic & electro-mechanical assembly, test, and packaging operation. ISO9001 company. Establish & maintain production schedules, improve efficiency & reduce cycle time, manage & develop staff.
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BS in Engineering, 5+ years in SMT and thru hole, mfg. engineering, NPI, DFM, good documentation and organizational skills, high volume, advanced manufacturing, problem solving skills. Duties/Functions: Provide support for new pr
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Purchasing,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
| https://unisoft-cim.com/cycle-times.html
PCB Cycle Times for Component Insertion on PC Board | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
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Universal Ai Button Single Cycle 21307101 Smt Ai Spare Parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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