Industry Directory | Consultant / Service Provider
G2 provides a complete, integrated, cloud-based solution that increases manufacturers' visibility, control and recovery of revenue.
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
New Equipment | Board Handling - Conveyors
Model No: KSUN B350 Automatic vacuum loader MAX PCB`s capacity: 300pcs (0.6mm thickness PCB) cycling time: Approx 6 seconds Power supply: 100-230V AC (customized), single phase Power load: MAX 180 VA Air pressure: 4-6 bar Air volume: MAX 30L
Electronics Forum | Wed Nov 16 10:56:43 EST 2005 | aj
The latest software packages and stopwatch will do the job but if your manager is anything like mine he wants to know straight away from the BOM. If you split the bom down between placement machines i.e. caps and resistors etc on chipshooter and ICs
Electronics Forum | Mon Jun 07 14:13:53 EDT 2004 | ricardof
Gabriele, yes you're right, but my question is more focused to restrictions as for the Operators, and then the performance in Screen Printer and Oven. The board has 400 high speed parts and 20 parts for Odd Shape machine (QFPs and 2 BGAs), Board is n
Used SMT Equipment | General Purpose Equipment
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
Used SMT Equipment | Pick and Place/Feeders
Panasonic NPM-D3A Modular Pick And Place MachineThe NPM-D3 is an industry standard building block in high-speed, high volume applications ranging from automotive to industrial to medical. In fact, the vast majority of automotive EMS providers choose
Industry News | 2003-05-02 08:49:07.0
Group to Assemble Data by Package and Technology Type
Industry News | 2013-08-20 23:02:16.0
Nordson ASYMTEK has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion, saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Parts & Supplies | SMT Equipment
USE ALTENATIVE PART FUJI RELAY G2R-212S-VNUS DC12V > USE ALTENATIVE PART FUJI RELAY G2R-112S-DC24V TO R2016A > USE ALTENATIVE FUJI RELAY G2R-212S-DC24V TO R2017A > USE ALTENATIVE FUJI RELAY G3R-102SLN DC24V/2A FUJI
Technical Library | 2019-01-10 10:24:47.0
We notice that the quantities of material that are to be dosed are becoming more and more divergent. In addition to large media volumes, small and very small quantities are also increasingly coming into focus. For example autonomous driving: These vehicles already produce an immense amount of data today. When potting the associated sensors, cameras, and ECUs, it is important to ensure a precise and repeatable media application – even with volumes of only 0.03 ml. In contrast, when high-voltage batteries for electric cars are potted, 5 to 10 litres of heat-conducting paste are required per vehicle – and the trend is rising. Optical bonding used in display production, on the other hand, is in the medium volume range. The challenge now is to cover the entire volume spectrum reliably and in compliance with the required cycle times. This is remedied by a modular system of scalable modules, which offers the customer the necessary flexibility and enables him to plan a system according to his needs.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | , Massachusetts | Engineering
General: The Manufacturing Test Engineer performs design, development and installation of tests covering electrical, vibration, ESS and burn in processes. Responsible for troubleshooting and improvement of various test processes. Responsibilities:
Career Center | Van Nuys, California USA | Management,Production
Electronic Source Company, Los Angeles, CA based, Electronic Manufacturing Services (CM) company, servicing the Aerospace, Space, Medical and Telecommunication, for life critical applications/segments, is in search of a hands on, results driven and
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | Vadodara, Gujarat India | Management,Research and Development,Sales/Marketing
# Proven track record of Leadership, Responsibility, Learning Abilities and Entrepreneurship. # Qualifications in Science, eCommerce, Software Technology and Entrepreneurship. # Over 18 years experience in Sales and Marketing, Business Developme
| https://unisoft-cim.com/cycle-times.html
. To use the Cycle Time by Part Number method you need to create a simple text file Library (.OPR) file with a minimum of two elements per line: 1) The part number. 2
GPD Global | https://www.gpd-global.com/pdf/doc/Advanced-FPC-Real-Time-Controller-User-Guide-22940009.pdf
Pedal connection. Reservoir mount and interface To assemble your reservoir (syringe) with the Time Pressure Interface and Taper-Lock Mount: 1. Screw a reservoir (syringe) and Luer-lock needle/nozzle onto the Time Pressure Interface per GPD Global Time
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