Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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Industry Directory | Equipment Dealer / Broker / Auctions
Maynards Europe is an European industrial auctioneer based in Germany and part of the global Maynards Industrial Group. We're selling high quality, preowned machines and equipment from all kind of industries.
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
Used SMT Equipment | SMT Equipment
1999 Mydata TP9-4 SMT Pick & Place Machine Dimensions: 104" L x 52" W x 60" H Cycle Count - 04317950 Serial: 4235 Item Location: Tampa, FL USA
Used SMT Equipment | Pick and Place/Feeders
2006 Siemens HF/3 SMT Pick & Place Cycles: 21,449,161 Note: The following items are included with this machine: (4) Feeder Carts (3) 12 Segment Placement Heads Serial: A402-12031214 Item Location: Guadalajara, Mexico
Industry News | 2024-02-26 16:22:08.0
HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Events Calendar | Mon Mar 04 18:30:00 UTC 2024 - Tue Mar 05 18:30:00 UTC 2024 | Ansty Park, Coventry United Kingdom
Counterfeit Electronics & Materials Symposium - UK
Events Calendar | Mon Jun 22 18:30:00 UTC 2020 - Wed Jun 24 18:30:00 UTC 2020 | College Park, Maryland USA
Symposium on Counterfeit Parts and Materials
Career Center | Providence, Rhode Island USA | Production
Manufacturing Supervisor for an electronic & electro-mechanical assembly, test, and packaging operation. ISO9001 company. Establish & maintain production schedules, improve efficiency & reduce cycle time, manage & develop staff.
Career Center | Shenzhen, China | Purchasing
Job requirements & responsibilities: 1. Skilled in English reading and writing. 2. Familiar with BOM and list analysis. 3. Familiar with electronic components, brands, and cycle life. 4. Skilled use of computer office software. 5. Good abil
Career Center | , | Production
SMT Process Specialist, yield improvbement, NPI to volume production, cycle time reductions, Standardisation, Process Improvements, Hands on people person, experienced
Career Center | , | Engineering,Maintenance,Production,Technical Support
Spare Parts Management, Time/Cycle Time Analysis Management, Production Management, Preventive Maintenance, Cross Functional Coordination, Instrumentation Engineering, Quality Management/ Calibration, Strong Interpersonal Skills, Inventory management
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
