Electronics Forum: d-279 (7)

Thermal screening for marginal BGA joints

Electronics Forum | Sat Nov 03 09:29:17 EDT 2007 | davef

IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree

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Electronics Forum | Tue Jun 18 09:00:39 EDT 2019 | edhare

Hi Matt. I recommend that you see also IPC-D-279, Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies, July 1996 or current revision.

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