Electronics Forum | Fri Dec 03 18:01:56 EST 1999 | M Cox
Usually the alignment problem comes from pad design. The ground pad (largest) is too small. If that is the case (and even if it isn't) try placing a dot of SMT adhesive before placement (it will cure before reflow and hold the part in place). Goo
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Integrated Offset Placement in Electronics Assembly Equipment The Answer for Solder Paste Misalignment News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Integrated Offset
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/pelletizers/cutting-chamber-with-die-plate
. This arrangement compensates for any misalignment between the cutter assembly and the die plate cutting surface In This Section Product Type Pelletizers HiCut™
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_7711-21-CIS.pdf
& MELF Removal/Installation and Localized Cleaning • Instructor Demonstration and Skills Development Lab • Gull Wing Procedures (SOIC, SOT, D-Pak, QFP
