Lead Free SMT Reflow Oven XMR-1000D Product features: ▶fully meet all kinds of lead-free welding process requirements. ▶WindowsXP operating system, English and Chinese interface, easy to learn operation; Standard air furnace, patented hot air system
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Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
Electronics Forum | Fri May 21 18:32:53 EDT 2004 | Abe Froman
We have been using nitrogen in our reflow ovens for many years to reduce oxidation on our solder joints. Management is concerned about the high cost of nitrogen and have suggested we use hydrogen instead. I'm not sure if this is a good idea, but we
Electronics Forum | Mon Jul 29 09:27:15 EDT 2013 | charliedci
All of our reflow is with room air, 63/37 and SAC305. I believe nitrogen will get you better looking solder joints (shiny, less grainy under magnification), but per IPC, functionality and strength I don't think there is much difference.
Industry News | 2018-10-18 08:02:28.0
What are the advantages of use nitrogen process for SMT reflow oven?
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
Technical Library | 2013-10-24 15:47:53.0
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. (...) The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth
· What is the difference between SMT vacuum reflow soldering machine and ordinary reflow soldering machine? · What problems can be solved by smt vacuum reflow soldering machine? · What is the basic principle of vacuum reflow machine? · Ho
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
SMTnet Express July 25, 2013, Subscribers: 34972, Members: Companies: 13435, Users: 34972 Using Automated 3D X-Ray Inspection to Detect BTC Defects by Barbara Koczera; Test Research USA , An Qi Zhao; Flextronics Detecting marginal joints and other
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints
| https://www.smtfactory.com/I-C-T-Acrab350-High-Stability-DIP-PCB-Nitrogen-Wave-Soldering-Machine-pd47307364.html
(Standard); Option:Spring Pressing Finger, Duck Mouth Finger Solder Pot Capacity Lead-free 500kg Machine Weight(kg) Approx.1800kg Approx.2100kg Option: External flux sprayer, Nitrogen protection, MES system
