PRIORITY Data Systems offers comparative rating solutions to the P & C insurance industry and their customers. PRIORITY also offers customized data management solutions, including data capture and mailing services.
Data Physics supplies vibration controllers, dynamic analysers, shakers and transducers for stress screening and vibration test applications.
.png)
PTI-500 First Article Inspection Tester 版本号：PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Electronics Forum | Tue Jan 24 22:32:09 EST 2023 | rgduval
So...FactoryLogix does all of that through integrations with KohYoung and Panasonic (as well as most other machines found in SMT assembly). Realtime data is captured during assembly by UID, and can be viewed in live dashboards, scheduled reports, et
Electronics Forum | Tue Feb 24 03:36:37 EST 2015 | jlawson
Also should look at Viscom 3088Flex Ultra if after AOI with 3D capability. The camera optics module has many innovative features, super fast data capture - much faster then Mirtek and KohYoung. Both these companies have taken 3DSPI and turned into AO
Used SMT Equipment | AOI / Automated Optical Inspection
SAKI Desktop AOI BF18D-P40 Inspection Machine Substrate flatness: ±2mm Board size:50 * 60 - 250 * 330mm PCB thickness: 0.6mm - 2.5mm weight::30KG ■ Industry-Leading High Throughput Leading High Throughput The Alternate Color Digital Scanning
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Industry News | 2003-06-02 09:14:01.0
Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x
Industry News | 2014-05-12 16:06:39.0
SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.
Technical Library | 2021-12-02 01:44:00.0
With the advent of Industry 4.0, production processes have been endowed with intelligent cyber-physical systems generating massive amounts of streaming sensor data. Internet of Things technologies have enabled capturing, managing, and processing production data at a large scale in order to utilize this data as an asset for the optimization of production processes. In this work, we focus on the automatic detection of physical defects in the production of surfacemount devices. We show how to build a classification model based on random forests that efficiently detects defect products with a high degree of precision. In fact, the results of our preliminary experimental analysis indicate that our approach is able to correctly determine defects in a simulated production environment of surface-mount devices with a MCC score of 0.96. We investigate the feasibility of utilizing this approach in realistic settings. We believe that our approach will help to advance the production of surface-mount devices.
Technical Library | 2022-10-11 20:29:31.0
Electronic assemblies deployed in harsh environments may be subjected to multiple thermal environments during the use-life of the equipment. Often the equipment may not have any macro-indicators of damage such as cracks or delamination. Quantiication of thermal environments during use-life is often not feasible because of the data-capture and storage requirements, and the overhead on core-system functionality. There is need for tools and techniques to quantify damage in deployed systems in absence of macro-indicators of damage without knowledge of prior stress history. The presented PHM framework is targeted towards high reliability applications such as avionic and space systems. In this paper, Sn3.0Ag0.5Cu alloy packages have been subjected to multiple thermal cycling environments including -55 to 125C and 0 to 100C. Assemblies investigated include area-array packages soldered on FR4 printed circuit cards. The methodology involves the use of condition monitoring devices, for gathering data on damage pre-cursors at periodic intervals. Damage-state interrogation technique has been developed based on the Levenberg-Marquardt Algorithm in conjunction with the microstructural damage evolution proxies. The presented technique is applicable to electronic assemblies which have been deployed on one thermal environment, then withdrawn from service and targeted for redeployment in a different thermal environment. Test cases have been presented to demonstrate the viability of the technique for assessment of prior damage, operational readiness and residual life for assemblies exposed to multiple thermo-mechanical environments. Prognosticated prior damage and the residual life show good correlation with experimental data, demonstrating the validity of the presented technique for multiple thermo-mechanical environments.
I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
Events Calendar | Tue May 16 00:00:00 EDT 2023 - Tue May 16 00:00:00 EDT 2023 | Milwaukee, Wisconsin USA
"Improving Reliability of Continuity and HiPot Testing" | Training Workshop | A Professional Development Course by CAMI Research
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
Career Center | Tampa, Florida USA | Engineering,Purchasing
Reptron Manufacturing Services, a large electronics contract manufacturer, is adding an experienced component engineer to it�s manufacturing integration team. Can be based in either Hibbing, Minnesota or Tampa, Florida. The successful candidate w
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
Career Center | Fort Mill, South Carolina USA | Engineering,Maintenance,Research and Development
Have serviced AMF pinspotters both mechanical and electrical sides; included repair of chassis pc boards to component level. 20 years in this field. Have worked in PCB manufacture with old style board populators and Panasert robots Worked in H
| https://www.eptac.com/wp-content/uploads/eptac/datasheets/EPTAC_DataSheet_PCED.pdf
EPTAC '05 Data Sheets 800-643-7822 eptac.com eptaccanada.ca Download the App at eptacapp.com TRAINING ■ Expert Training in the Latest Technologies
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pad-stack-data-file_topic2912.html
Pad Stack Data File - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Pad Stack Data File
.gif)
