Industry Directory | Manufacturer
Data I/O is the world's leading provider of manual and automated programming solutions for semiconductor (IC) devices. Data I/O's solutions, software and programming engine ensures devices are programmed correctly every time.
Industry Directory | Consultant / Service Provider
FP Instruments is a hardware and embedded systems design house based in Poland. Our specialty are IoT devices where wireless communications, data management and low power consumption requirements all come together.
New Equipment | Cleaning Equipment
PCB Surface Cleaning Machine SMM-450 PCB Surface Cleaning Machine SMM-450 The PCB Cleaning Machine is used to remove filth on the surface of PCB. Technical Parameters 1. Independent innovation patent design (patent: 2017SR471774), the industry's
New Equipment | Component Programming
Maximize performance and quality with the industry’s most robust and reliable offline automated programming system. The PS388 delivers unrivaled quality and flexibility in a small footprint Quality Programming Precision handling with Data I/O's
Electronics Forum | Mon Dec 07 11:33:25 EST 2020 | ecogroup
Getting these errors: No command response from handler (0x1000) .... DpBlockWriteL: TimeOutWait for ACK .... Loading SYSTEM data to DPRAM is failed ..... Failed to create empty document ..... No command response from handler (0xffff) ..... Faile
Electronics Forum | Tue Feb 21 10:11:23 EST 2012 | vinitverma
The top level password allowed for customers is "specialist". All in small letters.
Used SMT Equipment | In-Circuit Testers
Aeroflex IFR FB100A Aeroflex-IFR FB100A BER Test System The FB100A is a modular, expandable, high data rate BER (Bit Error Rate) test system. With operation from DC to 160 Mb/s, serial and/or parallel data interfacing and INSTALOK synchroniz
Used SMT Equipment | In-Circuit Testers
Aeroflex IFR FB100A Aeroflex-IFR FB100A BER Test System The FB100A is a modular, expandable, high data rate BER (Bit Error Rate) test system. With operation from DC to 160 Mb/s, serial and/or parallel data interfacing and INSTALOK synchroniz
Industry News | 2003-04-22 09:33:13.0
Honda Connectors has released its first Infiniband I/O connectors, designed for easy assembly in high-speed differential signal applications.
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
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Parts & Supplies | Screen Printers
1014794 MPM Momentum 125 computer USB IO data camera cable Other MPM parts we supply: MPM AccuFlex metal film scraper 150mm/220mm/250mm MPM AccuFlex metal film scraper 260mm/300mm/330mm MPM AccuFlex metal film scraper 360mm/420mm/430mm MPM Accu
Parts & Supplies | Screen Printers
1014857 MPM stop sensor 101579100 S-chuck 4pcs P1811 cylinder rodless for MPM 2500 P1810 regulator for MPM 2500 P4394 valve relief for MPM 2500 1019734 &
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-
PCB Surface Cleaning Machine MLPCM-450 Technical Parameters 1. Independent innovation patent design (patent: 2017SR471774), the industry's first, lets you have the most advanced contact cleaning system in the industry. 2. Using Panasonic PLC program
Events Calendar | Tue Jul 16 00:00:00 EDT 2024 - Tue Jul 16 00:00:00 EDT 2024 | ,
Arizona/Sonora & San Diego Joint Chapter Webinar: The Data Revolution Within SMT Manufacturing
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Webinar: The IPC Digital Twin Standard
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
Career Center | Gardena, California USA | Engineering
Qual-Pro Corporation provides electronic manufacturing solutions to multiple industries including aerospace, defense, ISR, medical, and precision industrial controls. Our company offers a challenging and rewarding environment with a tremendous opport
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
Career Center | Delton, Michigan USA | Engineering,Maintenance,Production,Technical Support
IPC Master instructor with a number of years experience in Engineering as well as Machine technician.
SMTnet Express March 14, 2013, Subscribers: 26245, Members: Companies: 13310, Users: 34436 Assembly and Reliability of 1704 I/O FCBGA and FPBGAs by: Reza Ghaffarian, Ph.D.; Jet Propulsion Laboratory, California Institute of Technology Commercial
KingFei SMT Tech | https://www.smtspare-parts.com/buy-smt_assembly_equipment-page5.html
:35 KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow Contact Now KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7, 9, and 12
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